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A3P250-FGG256
IC FPGA 157 I/O 256FBGA
- Hersteller
- Fr. Teil #A3P250-FGG256
- Paket LFBGA-256
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- Auf Lager7540
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Spezifikationen
| Package | Tray |
| Series | ProASIC3 |
| ProductStatus | Active |
| TotalRAMBits | 36864 |
| NumberofI/O | 157 |
| NumberofGates | 250000 |
| Voltage-Supply | 1.425V ~ 1.575V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 256-LBGA |
Übersicht
Description
The device comes in a 256-ball grid array (BGA) package, facilitating compact integration into various electronic systems. Key attributes include low power consumption, flash-based technology, and high reliability, which make it ideal for portable and battery-operated devices.
The A3P250 supports various I/O standards and configurations, allowing designers to tailor the FPGA to specific needs. It also features a user-friendly design environment with support for HDL (Hardware Description Language) programming. Overall, the A3P250-FGG256 is suitable for applications in telecommunications, automotive, industrial control, and consumer electronics, where rapid prototyping and customization are crucial.
Features
1. Capacity: 250,000 system gates, suitable for a range of applications.
2. I/O Pins: 256 I/O pins, allowing for extensive connectivity.
3. Low Power Consumption: Designed for battery-operated and energy-efficient applications.
4. Flash Technology: Non-volatile memory technology enables reprogramming and retains configurations without power.
5. Flexible Architecture: Supports various designs, from simple logic functions to complex systems.
6. Embedded Memory: Includes distributed RAM and larger memory blocks for data storage.
7. High Speed: Offers fast switching speeds, facilitating high-performance applications.
8. Temperature Range: Available in different variants to operate in various environmental conditions.
Ideal for communications, industrial control, and consumer electronics, the A3P250-FGG256 provides a good balance of performance, power efficiency, and flexibility.
Package
Pinout
The main functions of the A3P250-FGG256 include:
1. Logic Implementation: It provides programmable logic resources to implement custom digital circuits.
2. I/O Capabilities: The device supports various I/O standards, allowing for interfacing with different types of peripherals and communication protocols.
3. Embedded Memory: It includes embedded RAM blocks for data storage and processing.
4. Configurable Interconnect: Users can set up custom interconnections between logic resources to meet specific design requirements.
5. Low Power Operation: It is designed for low-power applications, making it suitable for battery-operated devices.
This FPGA is commonly used in applications such as telecommunications, automotive, and consumer electronics.
Manufacturer
Application
Equivalent
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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