B560C

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B560C

DIODE SCHOTTKY 60V 5A SMC

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  • Fr. Teil #B560C
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Spezifikationen

Part Status Active
Technology Schottky
Voltage - DC Reverse (Vr) (Max) 60 V
Current - Average Rectified (Io) 5A
Voltage - Forward (Vf) (Max) @ If 700 mV @ 5 A
Speed Fast Recovery =< 500ns, > 200mA (Io)
Current - Reverse Leakage @ Vr 250 µA @ 60 V
Capacitance @ Vr, F 240pF @ 4V, 1MHz
Grade Automotive
Qualification AEC-Q101
Mounting Type Surface Mount
Package / Case DO-214AB, SMC
Supplier Device Package SMC
Operating Temperature - Junction -55°C ~ 150°C

Übersicht

Description

B560C is a course designed to introduce students to advanced concepts in business, focusing on key areas such as strategic management, marketing, finance, and operations. The curriculum typically emphasizes analytical thinking and decision-making skills, preparing students to tackle real-world business challenges.
Students engage in case studies, group projects, and discussions that foster collaboration and practical application of theoretical concepts. The course often incorporates the latest industry trends and technologies, ensuring that learners are well-equipped for the dynamic business environment.
By the end of the course, participants should have a comprehensive understanding of how different business functions interconnect and contribute to overall organizational success. This foundational knowledge is crucial for those pursuing careers in management or entrepreneurship.

Features

The B560C is a motherboard from Intel’s B560 chipset, designed primarily for Intel 10th and 11th generation Core processors. Key features include:
1. Socket Type: LGA 1200, supporting both Intel Core and Pentium/Celeron processors.
2. Memory Support: Dual-channel DDR4 memory, typically up to 128GB with speeds of 3200 MHz.
3. Expansion Slots: PCIe slots for graphics cards and other components, often supporting PCIe 4.0 (with 11th gen CPUs).
4. Storage Options: Multiple SATA III ports and M.2 slots for SSDs, enabling fast storage solutions.
5. USB Ports: A variety of USB 3.2 Gen 1 and Gen 2 ports for high-speed data transfer.
6. Networking: Integrated Ethernet and often Wi-Fi 6 support, depending on the model.
7. Audio: High-definition audio codecs for enhanced sound quality.
Overall, the B560C is designed for budget-friendly builds, offering a balance of performance and essential features for gaming and productivity.

Package

The B560C is typically packaged in a LGA (Land Grid Array) format. This package type features a grid of contact pads on the underside, allowing for direct contact with the motherboard socket, ensuring efficient electrical connections and thermal management for Intel's B560 chipset.

Pinout

The B560C is a type of power management integrated circuit (PMIC) typically used in battery-powered applications. It usually comes in a compact 20-pin package.
The pin count and functions may vary slightly based on the specific manufacturer or variant, but generally, the pins are designated for the following purposes:
1. Input Voltage (Vin): Power supply input.
2. Ground (GND): Common ground connection.
3. Output Voltage (Vout): Regulated output voltage pins.
4. Enable (EN): Controls the power-up and power-down of the IC.
5. Feedback (FB): Used for voltage regulation and stability.
6. Compensation (COMP): For stability compensation in the regulation loop.
7. Inductor Connection (L): Interfaces with external inductors for switching regulation.
8. Status/Flag (STATUS): Indicates operational status or fault conditions.
For precise pin configuration and functions, refer to the specific datasheet from the manufacturer.

Manufacturer

The B560C is manufactured by ASRock, a company known for producing motherboards, graphics cards, and other computer hardware components. Founded in 2002 and headquartered in Taipei, Taiwan, ASRock initially started as a spin-off of ASUS but has since established itself as a key player in the computer hardware industry. The company focuses on providing high-quality, cost-effective solutions for gamers, enthusiasts, and everyday users. ASRock's product range includes motherboards for various chipsets, including Intel and AMD, as well as mini PCs and industrial solutions. They are recognized for innovation, reliability, and competitive pricing in the technology market.

Application

B560C, a variant of the B560 series, is commonly used in various application areas, including automotive electronics for control systems, consumer electronics like smartphones and tablets, industrial automation for embedded systems, and telecommunications for networking equipment. Its versatility allows for integration in smart devices, IoT applications, and robotics, enabling efficient processing and connectivity in these technologies.

Equivalent

The B560C chip is part of Intel's B560 chipset family, primarily designed for 10th and 11th Gen Intel Core processors. Equivalent products include the B560 chipset itself and similar chipsets like H570 and Z590, which offer varying features and performance levels. For AMD, an equivalent would be the B550 chipset, catering to Ryzen processors.

Versand

VersandmethodenWir

bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.


Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

Payment Methods

Die Zahlungsfrist ist 100% Prepaid.

Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:

1. PayPal

2. Kredit- / Debitkarte

3. Überweisung

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