BCM56870A0KFSBG

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BCM56870A0KFSBG

3.2T 32X100G MULTI LAYER SWITCH

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Spezifikationen

Package Tray
ProductStatus Active
Protocol Ethernet
Function Switch
Interface PCIe

Übersicht

Description

The BCM56870A0KFSBG is a high-performance Ethernet switch chip developed by Broadcom, designed for enterprise and data center applications. It features a multi-layer architecture that supports high bandwidth and low latency for efficient data processing. This switch typically includes features such as 10/25/40/100 Gigabit Ethernet interfaces, advanced traffic management, and support for various protocols including Ethernet, MPLS, and VLAN tagging.
Key capabilities often include support for software-defined networking (SDN), extensive QoS (Quality of Service) functionalities, and robust security features. The BCM56870 is optimized for scalability, allowing it to handle large-scale network deployments with ease.
This chip is commonly used in top-of-rack switches, routers, and other networking hardware, making it suitable for cloud computing, enterprise networks, and high-frequency trading environments. Its design emphasizes energy efficiency, making it an ideal choice for modern, eco-friendly data centers.

Features

The BCM56870A0KFSBG is a high-performance switch chipset from Broadcom, part of the Tomahawk family. It is designed for data center and enterprise networking, featuring:
1. 48 Ports of 10/25G Ethernet: Supports high-density connectivity with a mix of 10G and 25G interfaces.
2. Multi-rate Capabilities: Offers flexibility to support various Ethernet speeds including 10G, 25G, 40G, and 100G.
3. Scalability: Facilitates scalable network architecture with up to 6.4 Tbps of switching capacity.
4. Advanced Packet Processing: Includes features for deep packet inspection, classification, and QoS (Quality of Service).
5. Robust Layer 2/Layer 3 Features: Supports extensive L2 and L3 features, including routing, multicast, and VLAN functions.
6. Programmability: Offers programmable data plane capabilities, allowing custom applications and enhancements.
7. Energy Efficiency: Designed to optimize power consumption, making it suitable for large-scale deployments.
Ideal for building next-generation data center networks, it enhances performance while supporting a variety of applications.

Package

The BCM56870A0KFSBG is packaged in a FCLGA (Flip-Chip Land Grid Array) format. This package type allows for high-density interconnections and is suitable for complex networking applications, providing efficient thermal performance and electrical characteristics.

Pinout

The BCM56870A0KFSBG is a switch ASIC (Application-Specific Integrated Circuit) from Broadcom's StrataXGS series, specifically designed for high-performance networking applications. It features a pin count of 256 pins.
The main functions of the BCM56870A0KFSBG include:
1. Layer 2 and Layer 3 Switching: It supports advanced networking protocols for efficient data packet routing.
2. Multicast and Unicast Traffic Management: It handles both types of traffic effectively, ensuring optimal performance in complex network environments.
3. High Bandwidth: Designed to support high throughput and low latency for demanding applications.
4. Programmable Features: It allows for flexibility in deployment with programmable features catering to different networking requirements.
5. Integration with Various Interfaces: Supports various interfaces including Ethernet and others, enabling seamless connectivity.
This chip is typically used in enterprise-grade switches and routers, providing robust solutions for data center and service provider networks.

Manufacturer

The BCM56870A0KFSBG is manufactured by Broadcom Inc., a leading global technology company that specializes in semiconductors. Broadcom designs and develops a wide range of products, including networking chips, broadband communications systems, and wireless technologies. The company serves various markets, including data center, enterprise, and service provider segments, providing solutions that enable the efficient transfer of data across networks. Broadcom is recognized for its innovations in networking and connectivity, contributing significantly to the infrastructure of modern telecommunications and information technology.

Application

The BCM56870A0KFSBG is a high-performance Ethernet switch chip primarily used in data center networking, enterprise networking, and service provider applications. It supports various applications such as cloud networking, virtualization, high-density switching, and network function virtualization (NFV). Its advanced features enable efficient handling of large data flows and enhanced network performance, making it suitable for environments requiring high bandwidth and low latency.

Equivalent

The BCM56870A0KFSBG chip, a Broadcom Ethernet switch, has several equivalent products in the market. Notable alternatives include the Marvell Prestera series (e.g., 98DX3236) and the Cisco Nexus series switches that utilize similar ASIC technology. Additionally, products from Intel's Ethernet switch family can serve as alternatives depending on specific use cases and requirements. Always verify compatibility based on application needs and specifications.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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