BGM11S22F256GA-V2

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BGM11S22F256GA-V2

RX TXRX MOD BLUETOOTH CHIP SMD

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Spezifikationen

Package Tray
Series Blue Gecko
ProductStatus Active
RFFamily/Standard Bluetooth
Protocol Bluetooth v4.2
Modulation GFSK
Frequency 2.4GHz
DataRate 1Mbps
Power-Output 8dBm
Sensitivity -90dBm
SerialInterfaces I²C, SPI, UART
AntennaType Integrated, Chip
UtilizedIC/Part EFR32BG
MemorySize 256kB Flash, 32kB RAM
Voltage-Supply 1.85V ~ 3.8V
Current-Receiving 8.7mA
Current-Transmitting 8.2mA
MountingType Surface Mount
OperatingTemperature -40°C ~ 85°C

Übersicht

Description

The BGM11S22F256GA-V2 is a Bluetooth® 5.2 system-on-chip (SoC) module from Silicon Labs, designed for wireless connectivity applications. This module integrates a high-performance ARM Cortex-M4 processor with 256 KB of Flash memory and 32 KB of RAM, making it suitable for IoT devices requiring Bluetooth communication. It supports Bluetooth Low Energy (BLE) protocols, offering improved range, speed, and broadcast capacity over previous versions.
Key features include a compact form factor of 12.9 mm x 15.0 mm, making it ideal for space-constrained applications, and it provides low energy consumption, which is critical for battery-powered devices. The module also supports a wide operating temperature range and robust RF performance. It is equipped with comprehensive development tools and software stacks, facilitating quicker time to market for developers. Additionally, the BGM11S22F256GA-V2 supports advanced security features essential for secure data transmission in connected environments. This makes it a versatile choice for applications such as smart home devices, health and fitness trackers, and industrial IoT solutions.

Features

The BGM11S22F256GA-V2 is a highly integrated Bluetooth module designed for wireless connectivity applications. Key features include:
1. Bluetooth Compatibility: Supports Bluetooth Low Energy (BLE) 5.0, offering enhanced range and data throughput.

2. Processor: Equipped with an ARM Cortex-M4 core, providing efficient processing power for complex applications.
3. Memory: Includes 256 KB of Flash and 32 KB of RAM, facilitating adequate storage and fast execution of applications.
4. Integrated Antenna: Comes with a built-in antenna, simplifying design and reducing the need for external components.
5. Security: Offers robust security features, including AES encryption, to protect data transmission.
6. Interfaces: Includes multiple I/O options such as GPIO, I2C, SPI, and UART for versatile connectivity with other devices.
7. Low Power Consumption: Designed for battery-powered applications with low power modes to extend battery life.
8. Size and Form Factor: Compact size suitable for space-constrained applications.
9. Certification: Pre-certified to minimize regulatory hurdles and expedite time to market.
These features make the BGM11S22F256GA-V2 ideal for IoT applications, wearables, and other embedded systems requiring reliable Bluetooth connectivity.

Package

The BGM11S22F256GA-V2 is a Bluetooth module from Silicon Labs. It comes in a compact system-in-package (SiP) form factor which integrates the antenna, RF balun, and all necessary components, making it suitable for space-constrained applications.

Pinout

The BGM11S22F256GA-V2 is a Bluetooth module from Silicon Labs, part of the BGM11S series. It features a 32-pin configuration. This module is designed for Bluetooth Low Energy (BLE) applications and is built on an ARM Cortex-M4 processor with 256 kB of flash memory and 32 kB of RAM.
Key functions and features include:
1. Bluetooth Low Energy: Supports BLE for wireless communication.
2. Integrated Antenna: Simplifies design and reduces the need for external antenna components.
3. Energy Efficiency: Built for low-power operation, suitable for battery-powered devices.
4. Peripherals: Includes UART, SPI, I2C interfaces, and multiple GPIO pins for flexible connectivity.
5. Security: Features AES encryption for secure communications.
6. OTA Updates: Supports Over-the-Air firmware updates, facilitating easy maintenance.
7. Development Support: Compatible with Silicon Labs’ Simplicity Studio for development and debugging support.
This module is ideal for IoT applications requiring reliable BLE connectivity with minimal power consumption and ease of integration.

Manufacturer

The BGM11S22F256GA-V2 is manufactured by Silicon Labs. Silicon Labs is a technology company that specializes in the design and development of semiconductors, software, and solutions for a wide range of applications including the Internet of Things (IoT), industrial automation, consumer electronics, and automotive industries. The company is known for producing microcontrollers, wireless systems, sensors, and other components that are integral to modern electronic devices and systems. Silicon Labs is headquartered in Austin, Texas, and is regarded as a leader in providing innovative solutions for connected devices.

Application

The BGM11S22F256GA-V2 is a Bluetooth Smart module notable for its low energy consumption and integrated antenna. It's commonly used in applications requiring wireless connectivity, such as smart home devices, wearable technology, health and fitness monitors, asset tracking, and Internet of Things (IoT) applications. Its compact size and efficient power usage make it ideal for battery-operated devices.

Equivalent

The BGM11S22F256GA-V2 chip is a Bluetooth module from Silicon Labs. Equivalent products include Nordic Semiconductor's nRF52832, Texas Instruments' CC2640R2F, and Dialog Semiconductor's DA14531. These alternatives offer similar Bluetooth Low Energy (BLE) functionality and are suitable for IoT applications. When choosing a replacement, consider factors like power consumption, size, and specific feature requirements.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

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