EF2L45BG256B

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EF2L45BG256B

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Spezifikationen

Manufacturer JLCPCB Assembly
Package FBGA-256

Übersicht

Description

The EF2L45BG256B is a high-performance NAND flash memory chip designed for various applications, including consumer electronics, industrial devices, and automotive systems. It typically features a compact form factor, ensuring efficient space utilization in electronic designs. With a capacity of 256 gigabits (32 gigabytes), it offers ample storage for data-intensive applications.
This memory chip is based on advanced 3D NAND technology, enabling higher data density, improved durability, and faster read/write speeds compared to traditional 2D NAND solutions. It supports features such as error correction, wear leveling, and power loss protection, enhancing data integrity and longevity.
The EF2L45BG256B interfaces through standard protocols like ONFI or Toggle Mode, ensuring compatibility with various controllers and systems. Its versatility makes it suitable for use in smartphones, tablets, embedded systems, and other high-demand environments where reliable and efficient data storage is essential. Overall, the EF2L45BG256B represents a modern solution for expanding memory capabilities in a wide range of electronic applications.

Features

The EF2L45BG256B is a 256Mb (32MB) NAND Flash memory device, designed for high-performance applications. Key features include:
1. Organization: It is organized as 2048 blocks of 128 pages, with each page consisting of 2048 bytes of user data plus additional spare areas for error correction.

2. Interface: The device utilizes a parallel interface, allowing for easy integration into various systems.
3. High Performance: Supports fast read and write speeds, enhancing overall data transfer efficiency.
4. Reliability: Features advanced error correction capabilities and wear leveling to extend the lifespan of the memory.
5. Low Power Consumption: Designed for energy efficiency, making it suitable for battery-operated devices.
6. Temperature Range: Operates over a wide temperature range, ensuring functionality in diverse environments.
7. Applications: Ideal for use in consumer electronics, automotive, and industrial applications requiring reliable data storage.
These features make the EF2L45BG256B a versatile choice for modern digital storage solutions.

Package

The EF2L45BG256B is offered in a 64-ball FBGA (Fine Ball Grid Array) package. This compact packaging is designed for high-density applications, providing efficient thermal dissipation and optimal performance for memory devices.

Pinout

The EF2L45BG256B is a low-power, 256 Mb (32M x 8) DDR3 SDRAM memory device. It typically has a pin count of 78 pins in a TSOP-II (Thin Small Outline Package) configuration.
The primary functions of the pins include:
1. Data Inputs/Outputs (DQ): 8 bits for data transfer.
2. Address Inputs (A): Used to select the memory location.
3. Control Pins (CS, RAS, CAS, WE): For controlling read and write operations.
4. Clock Input (CK): Synchronization for data transfer.
5. Power Supply (VDD, VSS): Power connections for the device.
6. Mode Register Set (MRS) and Refresh Pins: For setting operational modes and refreshing the memory.
This device supports a wide range of functionalities, including burst read/write operations, and is designed for high performance in various applications.

Manufacturer

The EF2L45BG256B is manufactured by Etron Technology, Inc., a semiconductor company based in Taiwan. Etron specializes in memory and storage solutions, including DRAM and Flash products. Established in 1991, the company focuses on developing advanced memory technologies for various applications, including consumer electronics, computing, and industrial devices. Etron is recognized for its innovative contributions to the memory sector, particularly in the areas of low-power and high-performance memory solutions.

Application

The EF2L45BG256B is a high-performance embedded flash memory chip, primarily used in applications such as automotive electronics, industrial automation, consumer electronics, and IoT devices. Its features support data logging, firmware updates, and configuration storage in applications requiring durability and reliability in harsh environments.

Equivalent

The EF2L45BG256B chip is a type of SRAM. Equivalent products may include similar SRAM chips from other manufacturers, such as the CY7C1041DV33-10 from Cypress, the AS6C4016-55TQ from Alliance Semiconductor, and the IS61LV25616AL from ISSI. Always check specifications for compatibility in your application.

Versand

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bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.


Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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