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EP2AGX260FF35I3N
IC FPGA 612 I/O 1152FBGA
- Hersteller
- Fr. Teil #EP2AGX260FF35I3N
- Paket FBGA-1152
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Spezifikationen
| Package | Tray |
| Series | Arria II GX |
| ProductStatus | Obsolete |
| NumberofLABs/CLBs | 10260 |
| NumberofLogicElements/Cells | 244188 |
| TotalRAMBits | 12038144 |
| NumberofI/O | 612 |
| Voltage-Supply | 0.87V ~ 0.93V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 1152-BBGA, FCBGA |
Übersicht
Description
This FPGA offers advanced processing capabilities, including DSP blocks for high-speed signal processing, as well as embedded memory blocks that enhance data handling and storage. With its 35nm process technology, the EP2AGX260FF35I3N achieves a balance of performance and power efficiency, making it ideal for applications in telecommunications, automotive, industrial automation, and more.
The part number indicates specifics such as device family, density, package type (FF for Fine Pitch Flip Chip), and operating temperature range (I3 for industrial). Overall, the EP2AGX260FF35I3N provides a flexible and powerful solution for developers needing customizable hardware for demanding applications.
Features
1. Logic Elements: Approximately 260,000 logic elements, enabling complex designs and high processing capabilities.
2. Memory: Supports up to 11.5 Mbits of on-chip memory and multiple memory interfaces for high-speed data access.
3. DSP Blocks: Contains up to 840 DSP blocks for efficient digital signal processing tasks, suitable for applications like audio and video processing.
4. I/O Support: Offers a range of I/O standards, including LVDS, allowing for flexible connectivity options.
5. High-Speed Transceivers: Equipped with transceivers capable of operating at speeds up to 28 Gbps, facilitating high-bandwidth applications.
6. Power Efficiency: Designed for low power consumption while maintaining performance, ideal for embedded and portable designs.
7. Development Tools: Compatible with Intel's Quartus Prime software for streamlined design and integration.
These features make the EP2AGX260FF35I3N suitable for applications in telecommunications, industrial automation, and high-performance computing.
Package
Pinout
The functions of these pins include various I/O capabilities, power supply inputs, ground connections, and dedicated pins for configuration and clock management. The FPGA supports multiple I/O standards and provides flexibility for high-speed serial communication, parallel data processing, and interfacing with other devices.
In summary, the EP2AGX260FF35I3N has 484 pins, serving multiple functions like general-purpose I/O, configuration, and power connections, suitable for complex applications in digital design and signal processing.
Manufacturer
Application
Equivalent
1. Xilinx Artix-7 series (e.g., XC7A200T)
2. Lattice ECP5 series (e.g., LFE5U-85F)
3. Microsemi SmartFusion2 series (e.g., M2S050)
These alternatives vary in specifications, so ensure compatibility with your specific application requirements.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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