EP3C55F780I7N

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EP3C55F780I7N

IC FPGA 377 I/O 780FBGA

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Spezifikationen

Series Cyclone® III
Part Status Active
Base Product Number EP3C55
DigiKey Programmable Not Verified
Number of LABs/CLBs 3491
Number of Logic Elements/Cells 55856
Total RAM Bits 2396160
Number of I/O 377
Voltage - Supply 1.15V ~ 1.25V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package 780-BGA
Supplier Device Package 780-FBGA (29x29)
Packaging Tray

Übersicht

Description

The EP3C55F780I7N is a member of the Intel/Altera Cyclone III FPGA family, known for its cost-effectiveness and efficient performance. This specific model features a total of 55,000 logic elements, making it suitable for various applications, including digital signal processing, embedded systems, and communications.
Key specifications include a maximum operating frequency, support for various I/O standards, and ample memory resources, including SRAM blocks. The device comes in a 780-pin fine-pitch ball grid array (FBGA) package, facilitating effective thermal performance and reduced board space.
Designed for low power consumption, the EP3C55F780I7N is ideal for portable and battery-operated devices while maintaining high performance. It supports advanced features like embedded multipliers and DSP blocks, making it suitable for complex computations.
Developers can use the Quartus Prime software for design implementation, allowing for easy integration with various peripherals and communication protocols. Overall, the EP3C55F780I7N serves as a versatile solution for a wide range of digital design applications.

Features

The EP3C55F780I7N is a member of the Intel Cyclone III FPGA family, designed for high-performance applications. Key features include:
1. Logic Elements: It contains up to 55,000 logic elements, providing significant programmable logic capacity.
2. Memory: The device offers up to 1.5 Mbits of embedded memory, which can be utilized for data storage and buffering.
3. I/O Pins: It includes 780 user-configurable I/O pins, enabling flexible interfacing options for various applications.
4. DSP Blocks: Features dedicated DSP blocks for efficient digital signal processing tasks.
5. Low Power Consumption: Designed for low power operation, making it suitable for mobile and battery-powered applications.
6. Configuration Options: Supports various configuration modes for flexibility in design.
7. Development Tools: Compatible with Intel's Quartus Prime software for design and simulation.
This FPGA is ideal for applications in communications, automotive, and industrial control, balancing performance and power efficiency.

Package

The EP3C55F780I7N is packaged in a Fine Pitch Ball Grid Array (FBGA) format. This type of package features an array of solder balls on the underside for surface mounting, allowing for a compact design and efficient thermal performance.

Pinout

The EP3C55F780I7N is a member of Altera's Cyclone III FPGA family. It features a total of 780 pins. This device is designed for various applications, including communications, automotive, and industrial controls, providing a balance between performance and low power consumption.
The pins serve multiple functions, including:
1. I/O Pins: Configurable for various input/output functions, supporting different voltage levels and standards.
2. Power Supply Pins: For powering the FPGA core and I/O banks.
3. Clock Pins: For connecting external clock sources.
4. Configuration Pins: Used for programming the FPGA during power-up.
5. JTAG Pins: For boundary scan and in-system programming.
Overall, the EP3C55F780I7N is versatile, enabling designers to implement complex logic and interconnect various peripherals efficiently.

Manufacturer

The EP3C55F780I7N is manufactured by Intel Corporation, specifically under its Programmable Solutions Group (formerly Altera). Intel is a multinational technology company headquartered in Santa Clara, California. It is one of the largest semiconductor manufacturers in the world, known for its microprocessors and various computing technologies. The company has expanded into field-programmable gate arrays (FPGAs) and other programmable logic devices following its acquisition of Altera in 2015. The EP3C55F780I7N is part of the Cyclone III FPGA family, which is designed for cost-sensitive and low-power applications, making it suitable for a wide range of industrial, automotive, and consumer electronics uses.

Application

The EP3C55F780I7N is a Cyclone III FPGA from Intel, commonly used in applications such as digital signal processing, automotive systems, industrial automation, telecommunications, video processing, and embedded systems. Its versatility allows for custom logic implementation, high-speed data handling, and integration with various peripherals, making it suitable for diverse applications requiring real-time processing and flexible hardware configurations.

Equivalent

The EP3C55F780I7N chip, part of the Altera Cyclone III series, has equivalent products in the same family or similar FPGA families, such as the Xilinx Spartan-6 series (e.g., XC6SLX30) and Lattice ICE40 series. For specific applications, consider other Cyclone III variants with similar logic density, or look at newer FPGA families like Cyclone IV or V for enhanced features. Always verify compatibility based on your design requirements.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

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