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EP3SL50F484C3N
IC FPGA 296 I/O 484FBGA
- Hersteller
- Fr. Teil #EP3SL50F484C3N
- Paket FBGA-484
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Spezifikationen
| Package | Tray |
| Series | Stratix® III L |
| ProductStatus | Obsolete |
| NumberofLABs/CLBs | 1900 |
| NumberofLogicElements/Cells | 47500 |
| TotalRAMBits | 2184192 |
| NumberofI/O | 296 |
| Voltage-Supply | 0.86V ~ 1.15V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 484-BBGA, FCBGA |
Übersicht
Description
Key aspects of the EP3SL50F484C3N include:
1. Architecture: Built on a 65nm process technology, it offers high density and performance while reducing power consumption.
2. I/O Capabilities: Supports various I/O standards, making it versatile for different interfacing needs.
3. Memory: Incorporates embedded memory blocks for efficient data storage and processing.
4. DSP Blocks: Features dedicated Digital Signal Processing (DSP) blocks for high-speed arithmetic operations.
5. Development Tools: Compatible with Intel’s Quartus Prime design software, facilitating design and implementation processes.
This FPGA is suitable for applications that require flexibility, high performance, and advanced processing capabilities.
Features
1. Logic Capacity: Offers 50,000 logic elements (LEs), enabling complex designs.
2. Embedded Memory: Includes up to 1.2 Mbits of embedded memory blocks, supporting efficient data storage.
3. DSP Blocks: Features dedicated DSP (Digital Signal Processing) blocks for enhanced signal processing tasks.
4. I/O Support: Supports multiple I/O standards, including LVDS and SSTL, with up to 36 dedicated I/O pins.
5. Configuration Options: Can be configured via JTAG or other methods, facilitating easy design updates.
6. Power Management: Offers low power consumption modes suitable for energy-efficient designs.
7. High-Speed Performance: Capable of operating at high clock frequencies, making it suitable for demanding applications.
Ideal for telecommunications, automotive, and industrial control applications, the EP3SL50F484C3N combines flexibility with robust performance.
Package
Pinout
The functions of these pins include:
- I/O pins for general-purpose input and output.
- Configurable pins that support various protocols (such as LVDS, PCI Express, etc.).
- Power supply pins for core and I/O voltages.
- Ground pins for proper electrical grounding.
This FPGA is designed for high-performance applications, offering a combination of logic elements, memory blocks, and digital signal processing capabilities. The specific pin assignments and their functions can be found in the device's datasheet, which provides detailed information about I/O standards, power distribution, and package dimensions.
Manufacturer
Application
Equivalent
1. Xilinx Spartan-6 series (e.g., XC6SLX50)
2. Lattice ECP3 series (e.g., LFE3-50EA)
3. Microsemi SmartFusion or IGLOO series
When selecting an equivalent, consider factors like logic cells, I/O count, and specific application requirements.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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