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EP4SGX230FF35C3G
IC FPGA 564 I/O 1152FBGA
- Hersteller
- Fr. Teil #EP4SGX230FF35C3G
- Paket FBGA-1152
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Spezifikationen
| Package | Tray |
| ProductStatus | Active |
Übersicht
Description
Key specifications include 230,000 logic elements, high-speed transceivers, and substantial memory resources, making it ideal for complex computations and parallel processing tasks. The FPGA supports various I/O standards and provides flexibility in hardware design, allowing developers to customize functionalities as per application requirements.
Additionally, the EP4SGX230FF35C3G is equipped with robust tools and development support from Intel, facilitating easier implementation and optimization of hardware designs. Its capabilities make it suitable for industries such as aerospace, automotive, and industrial automation, where reliability and performance are critical.
Features
1. Logic Elements: Offers 230,000 logic elements, providing substantial capacity for complex designs.
2. Memory: Integrated with up to 10.5 Mbits of embedded memory, enabling efficient data storage and retrieval.
3. DSP Blocks: Equipped with 240 DSP blocks, supporting high-speed arithmetic operations for signal processing tasks.
4. I/O Capabilities: Features a wide range of I/O standards, including LVDS, supporting high-speed data transfer.
5. Fabric: Utilizes a 35nm process technology for improved performance and power efficiency.
6. Power Management: Offers flexible power management options, allowing for reduced power consumption.
7. High-Speed Transceivers: Contains multi-gigabit transceivers for high-speed serial connectivity.
These features make the EP4SGX230FF35C3G suitable for advanced applications in telecommunications, data centers, and high-performance computing.
Package
Pinout
The FPGA features include multiple I/O standards, embedded memory blocks, and DSP blocks. It supports high-speed serial interfaces and is suitable for applications in telecommunications, data centers, and other areas requiring large-scale parallel processing.
In summary, the EP4SGX230FF35C3G has 35,000 pins and serves as a versatile platform for custom logic design and advanced processing tasks in various industries.
Manufacturer
Application
Equivalent
1. Xilinx Kintex-7 series, such as K325T.
2. Lattice ECP5 series, suitable for lower density applications.
3. Microsemi SmartFusion2 series for similar functionality.
Check specific requirements for compatibility, features, and performance before selection.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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