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FDD8896-F085
MOSFET N-CH 30V 17A/94A TO252AA
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- Fr. Teil #FDD8896-F085
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- Datenblatt FDD8896-F085 DataSheet
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Spezifikationen
| Series | PowerTrench® |
| Part Status | Obsolete |
| FET Type | N-Channel |
| Technology | MOSFET (Metal Oxide) |
| Drain to Source Voltage (Vdss) | 30 V |
| Current - Continuous Drain (Id) @ 25°C | 17A (Ta), 94A (Tc) |
| Drive Voltage (Max Rds On, Min Rds On) | 4.5V, 10V |
| Rds On (Max) @ Id, Vgs | 5.7mOhm @ 35A, 10V |
| Vgs(th) (Max) @ Id | 2.5V @ 250µA |
| Gate Charge (Qg) (Max) @ Vgs | 60 nC @ 10 V |
| Vgs (Max) | ±20V |
| Input Capacitance (Ciss) (Max) @ Vds | 2525 pF @ 15 V |
| Power Dissipation (Max) | 80W (Tc) |
| Operating Temperature | -55°C ~ 175°C (TJ) |
| Grade | Automotive |
| Qualification | AEC-Q101 |
| Mounting Type | Surface Mount |
| Supplier Device Package | TO-252AA |
| Package / Case | TO-252-3, DPAK (2 Leads + Tab), SC-63 |
| Base Product Number | FDD889 |
Übersicht
Description
It typically comes in a compact package, facilitating space-saving designs in electronics. The device is characterized by fast switching speeds, which enhance overall system efficiency. Additionally, the FDD8896-F085 offers robust thermal performance, allowing it to operate effectively in demanding environments.
Due to its specifications, the FDD8896-F085 is commonly used in automotive, industrial, and consumer electronics applications, where reliability and performance are critical. Proper thermal management practices are essential to ensure the longevity and effectiveness of the MOSFET in circuit designs.
Features
1. Dual-band Operation: Supports both 900 MHz and 1800 MHz frequency bands, making it suitable for various GSM and LTE applications.
2. High Efficiency: Offers improved power efficiency, which helps extend battery life in mobile devices.
3. Low Noise Figure: Ensures better signal quality and reception in challenging environments.
4. Integrated Functionality: Combines multiple RF functions, reducing the need for additional external components, thereby saving board space and simplifying design.
5. Thermal Management: Enhanced thermal performance allows for reliable operation under high-power conditions.
6. Small Package Size: Available in a compact package, facilitating integration into space-constrained applications.
Overall, the FDD8896-F085 is engineered for high-performance RF communication, making it ideal for mobile and data devices.
Package
Pinout
The pin functions are as follows:
1. Gate (G): Controls the MOSFET's on/off state.
2. Drain (D): The output terminal where the load is connected.
3. Source (S): The terminal connected to ground or the lower potential in the circuit.
4. Body Diode (D): An internal diode providing reverse conduction capability.
Other pins might include additional features depending on the specific package and configuration, such as a thermal pad or heat sink. Always refer to the datasheet for exact pin configuration and electrical characteristics for your application.
Manufacturer
Application
Equivalent
Versand
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Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
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2. Kredit- / Debitkarte
3. Überweisung
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