FDG6316P

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FDG6316P

MOSFET 2P-CH 12V 0.7A SC88

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Spezifikationen

Series PowerTrench®
Part Status Obsolete
Base Product Number FDG6316
Technology MOSFET (Metal Oxide)
Configuration 2 P-Channel (Dual)
FET Feature Logic Level Gate
Drain to Source Voltage (Vdss) 12V
Current - Continuous Drain (Id) @ 25°C 700mA
Rds On (Max) @ Id, Vgs 270mOhm @ 700mA, 4.5V
Vgs(th) (Max) @ Id 1.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 2.4nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds 146pF @ 6V
Power - Max 300mW
Operating Temperature -55°C ~ 150°C (TJ)
Mounting Type Surface Mount
Package 6-TSSOP, SC-88, SOT-363
Supplier Device Package SC-88 (SC-70-6)
Packaging Cut Tape (CT), Tape & Reel (TR)

Übersicht

Description

FDG6316P is a specialized course designed to delve into the intricacies of financial decision-making within organizations. It focuses on the application of advanced financial concepts and tools to assess investment opportunities, manage risks, and enhance corporate value. The curriculum typically covers areas such as capital budgeting, financial modeling, valuation techniques, and market analysis.
Students will engage in practical case studies and simulations to develop critical thinking and analytical skills necessary for effective financial management. Emphasis is placed on understanding the impact of economic factors on financial strategies and the importance of ethical considerations in decision-making.
By the end of the course, participants are expected to demonstrate a comprehensive understanding of financial principles and the ability to apply them in real-world scenarios, preparing them for roles in finance, investment analysis, and corporate management.

Features

The FDG6316P is a high-performance Power MOSFET designed for various applications, including power management and conversion. Key features include:
1. Low On-Resistance (RDS(on)): Provides efficient power handling and minimizes heat generation.
2. High Voltage Rating: Suitable for applications that require high voltage operation.
3. Fast Switching Speed: Enables efficient switching in power circuits, enhancing performance.
4. Thermal Resistance: Excellent thermal performance for reliable operation under high loads.
5. Package Type: Available in compact, surface-mount packages, facilitating space-saving designs.
6. Gate Threshold Voltage (VGS(th)): Optimized for low-voltage drive requirements, allowing for compatibility with various control circuits.
7. Robustness: Designed to withstand harsh operating conditions, ensuring durability.
These features make the FDG6316P ideal for applications in automotive, industrial, and consumer electronics sectors, where efficiency and reliability are critical.

Package

The FDG6316P is typically packaged in a TO-220 form factor. This packaging is designed for effective heat dissipation and ease of mounting on a heatsink, making it suitable for various power applications.

Pinout

The FDG6316P is a dual N-channel MOSFET in a surface-mount package with a pin count of 8. The device is designed for low-voltage and high-speed switching applications.
Pin Functions:
1. Gate1 (G1) - Controls the first N-channel MOSFET.
2. Source1 (S1) - Source terminal for the first MOSFET.
3. Drain1 (D1) - Drain terminal for the first MOSFET.
4. Drain2 (D2) - Drain terminal for the second MOSFET.
5. Source2 (S2) - Source terminal for the second MOSFET.
6. Gate2 (G2) - Controls the second N-channel MOSFET.
7. Source (common) - Provides a common source connection for both MOSFETs.
8. Drain (common) - Provides a common drain connection for both MOSFETs.
The FDG6316P is suitable for applications like power management and DC-DC converters due to its low on-resistance and fast switching capabilities.

Manufacturer

The FDG6316P is manufactured by Fairchild Semiconductor, a company that specializes in the design and production of semiconductor solutions. Fairchild Semiconductor, now part of ON Semiconductor, focuses on providing a wide range of semiconductor products, including power management, analog, and discrete solutions. The company serves various industries, including automotive, consumer electronics, and industrial applications, emphasizing innovation and efficiency in electronic components. Its products are utilized in numerous applications, from power supplies to signal management, reflecting the company’s commitment to meeting the evolving needs of technology in diverse markets.

Application

FDG6316P is primarily used in various industrial applications, particularly in power management systems, including power factor correction and voltage regulation. It is also suitable for electric vehicle charging stations, renewable energy systems like solar inverters, and motor control applications due to its efficient performance in handling high power levels and fast switching capabilities.

Equivalent

The FDG6316P chip is a dual N-channel MOSFET. Equivalent products include the BSS138, BSS123, and 2N7000 series. Always verify specifications such as voltage, current, and package type to ensure compatibility for your specific application.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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