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FDMF3180
LOW VOLTAGE SMART POWER STAGE 3
- Hersteller
- Fr. Teil #FDMF3180
- Paket 39-PowerVFQFN
- Datenblatt
- Auf Lager2077
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Spezifikationen
| Package | Tape & Reel (TR),Cut Tape (CT),Bulk |
| ProductStatus | Active |
| OutputConfiguration | Half Bridge (2) |
| Applications | General Purpose |
| Interface | Logic, PWM |
| LoadType | Inductive, Capacitive |
| Technology | Power MOSFET |
| Current-Output/Channel | 70A |
| OperatingTemperature | -40°C ~ 125°C (TA) |
| FaultProtection | Current Limiting, Over Temperature, UVLO |
| MountingType | Surface Mount |
| Package/Case | 39-PowerVFQFN |
Übersicht
Description
Generally, an introductory course would cover the fundamental principles and concepts of its subject, providing students with a foundational understanding necessary for more advanced study. The course might include lectures, readings, discussions, and practical exercises related to the topic.
For detailed information, such as the syllabus, objectives, and prerequisites, it would be best to consult the institution offering the course or check the course catalog or website where it is listed. This will provide specific insights into what FDMF3180 entails and what students can expect to learn.
Features
1. Integration: Combines a driver IC, synchronous MOSFETs, and a Schottky diode in a single package, reducing board space and improving reliability.
2. Efficiency: Offers high efficiency across a wide load range, thanks to its advanced MOSFET technology and optimized driver design.
3. Current Sensing: Includes accurate current sensing for enhanced system performance and reliability.
4. Protection Features: Provides built-in protections such as over-current, over-temperature, and under-voltage protection to enhance system safety.
5. Thermal Performance: Designed for improved thermal performance, enabling higher power density and reducing the need for additional cooling components.
6. Flexible Compatibility: Can be used with a variety of control ICs, providing design flexibility for different applications.
7. Package: Typically available in a compact PQFN package, facilitating easy integration into modern circuit boards.
These features make the FDMF3180 suitable for applications requiring high power density, efficiency, and reliability.
Package
Pinout
Key functionalities include:
1. Integrated Driver and MOSFETs: Combines high-side and low-side MOSFETs with a driver.
2. Current Sensing: Provides accurate current feedback for control and protection.
3. Protection Features: Includes over-current protection (OCP), over-temperature protection (OTP), and under-voltage lockouts (UVLO).
4. Efficient Switching: Optimized for high-frequency operations, reducing power loss.
5. Fault Reporting: Communicates faults to the system controller to ensure safe operation.
These features make it suitable for high-performance computing applications where efficient power conversion is critical.
Manufacturer
Application
Equivalent
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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