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GD25Q80CEIGR
IC FLASH 8MBIT SPI/QUAD 8USON
- Hersteller
- Fr. Teil #GD25Q80CEIGR
- Paket 8-XFDFN Exposed Pad
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Spezifikationen
| Package | Tape & Reel (TR),Cut Tape (CT) |
| ProductStatus | Not For New Designs |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NOR |
| MemorySize | 8Mb (1M x 8) |
| MemoryInterface | SPI - Quad I/O |
| ClockFrequency | 120 MHz |
| WriteCycleTime-WordPage | 50µs, 2.4ms |
| Voltage-Supply | 2.7V ~ 3.6V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 8-XFDFN Exposed Pad |
Übersicht
Description
Key specifications include a voltage range of 2.7V to 3.6V, a maximum clock frequency of 104 MHz, and various programming and erasing options, including page programming and sector or bulk erase capabilities. The GD25Q80CEIGR offers features like deep power-down mode for energy efficiency and supports a wide range of commands for read, write, and erase operations. Its small footprint and compatibility with standard SPI protocols make it easy to integrate into various designs. Overall, the GD25Q80CEIGR is a versatile choice for embedded memory solutions.
Features
1. Capacity: 8 Megabits (1 MB) of storage.
2. Interface: SPI (Serial Peripheral Interface), supporting dual and quad I/O modes for faster data transfer.
3. Operating Voltage: Typically operates at 3V, with a wide range from 2.7V to 3.6V.
4. Read Speed: Up to 104 MHz in single mode and higher in dual/quad modes.
5. Write/Erase Cycles: Supports up to 100,000 program/erase cycles per sector.
6. Package Options: Available in multiple package types including SOIC, WSON, and DFN.
7. Sector Architecture: Divided into 64 sectors of 16 KB each, allowing for flexible data management.
8. Low Power Consumption: Designed for low power operation, making it suitable for battery-powered applications.
9. Data Retention: Retains data for 20 years at 85°C.
These features make the GD25Q80CEIGR suitable for a variety of applications, including consumer electronics, automotive, and industrial systems.
Package
Pinout
1. CS# (Chip Select): Active low signal to enable the device.
2. SO (Serial Output): Data output line for reading.
3. WP# (Write Protect): Protects the memory from being written when high.
4. VSS: Ground connection.
5. SCK (Serial Clock): Clock signal for synchronizing data transmission.
6. SI (Serial Input): Data input line for writing.
7. HOLD#: Pauses the operation when low.
8. VCC: Power supply for the chip.
This device typically supports SPI (Serial Peripheral Interface) communication, allowing for various read, write, and erase operations. It has a storage capacity of 8 Mbit (1 MB).
Manufacturer
Application
Equivalent
1. Winbond W25Q80BV
2. Micron MT25QL802A
3. Spansion S25FL080P
4. Cypress S25FL080L
5. Macronix MX25L8006E
These alternatives may vary in package type, voltage, and specific features, so compatibility should be verified based on the application requirements.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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