GD9FU2G8F3AMGI

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GD9FU2G8F3AMGI

IC FLASH 2GBIT ONFI

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Spezifikationen

Series GD9F
Part Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (SLC)
Memory Size 2Gbit
Memory Organization 256M x 8
Memory Interface ONFI
Write Cycle Time - Word, Page 20ns
Access Time 18 ns
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 48-TFSOP (0.724", 18.40mm Width)
Supplier Device Package 48-TSOP I

Übersicht

Description

GD9FU2G8F3AMGI appears to be a code or identifier, but without specific context, it is difficult to provide a precise introduction. It could relate to various fields such as technology, database management, product identification, or even a serial number for an item. If this code is associated with a particular system, project, or concept, further details are needed to give a more accurate explanation or introduction. Please provide more context or specify the area of interest related to GD9FU2G8F3AMGI for a clearer response.

Package

The GD9FU2G8F3AMGI package type is typically a WLCSP (Wafer-Level Chip Scale Package), designed for compact applications requiring minimal space. This type of packaging provides excellent electrical performance and thermal management, making it suitable for mobile and portable devices.

Pinout

The GD9FU2G8F3AMGI is a NAND flash memory chip produced by GigaDevice. It features a pin count of 48 pins. This chip is typically used for data storage in various applications, such as mobile devices, consumer electronics, and embedded systems.
The key functions of the GD9FU2G8F3AMGI include:
1. Data Storage: It provides non-volatile storage capabilities, allowing for the retention of data without a power supply.
2. High Speed: Designed for high-speed data reading and writing, improving overall performance in applications.
3. Interface: It generally supports a serial interface, facilitating easy integration with microcontrollers and other hardware components.
4. Wear Leveling: It may include functionality for wear leveling, extending the lifespan of the memory by distributing write and erase cycles evenly.
For specific applications and electrical characteristics, consulting the manufacturer's datasheet is recommended.

Manufacturer

The GD9FU2G8F3AMGI is a product manufactured by GigaDevice Semiconductor Inc., a company based in China. GigaDevice specializes in the design and production of flash memory solutions and microcontrollers. Founded in 2005, it focuses on providing a range of semiconductor products, including NOR Flash, NAND Flash, and various memory and non-memory ICs. GigaDevice serves various industries, including consumer electronics, automotive, and industrial applications, emphasizing innovation and quality in its offerings.

Equivalent

The GD9FU2G8F3AMGI chip is a NAND flash memory device. Equivalent products may include other NAND flash chips with similar specifications, such as the Micron MT29F2G08ABAEAWP, Samsung K9GAG08U0M, and Toshiba TH58TEG7D2LBA. Always verify compatibility based on specific application requirements, voltage, speed, and form factor.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

Payment Methods

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