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H26M51002KPR
16GB eMMC 5.1 FBGA-153 Memory (ICs) RoHS
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- Fr. Teil #H26M51002KPR
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- Datenblatt H26M51002KPR DataSheet
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Spezifikationen
| Packaging | FBGA-153 |
| Controller Operating Voltage (VCCQ) | 1.7V~1.95V |
| Controller Stand-By Current | 120uA |
| Interface | eMMC 5.1 |
| Memory Size | 16GB |
| NAND Operating Voltage (VCCF) | 2.7V~3.6V |
| NAND Stand-By Current | 30uA |
| Operating temperature | -25℃~+85℃ |
| Reading Speed in Sequence | 250MB/S |
| Writing Speed in Sequence | 45MB/S |
Übersicht
Description
The "H26M" prefix indicates the product series, while "51002" may denote specific characteristics such as the chip's architecture or capacity. The "KPR" suffix often signifies packaging and temperature range specifications.
Overall, H26M51002KPR is part of the evolution of flash memory technology aimed at supporting the growing demands for efficient and reliable storage solutions in modern electronics. Its use of advanced fabrication processes allows for improved performance and durability, making it suitable for both consumer and industrial applications.
Features
1. Density: 512 Mb storage capacity, suited for embedded systems and mobile applications.
2. Interface: Uses a NAND flash interface for efficient data transfers, typically with an ONFI (Open NAND Flash Interface) standard.
3. Page Size: Supports various page sizes, typically around 2K or 4K bytes, optimizing read and write operations.
4. Data Transfer Rates: High-speed data transfer capabilities, enhancing performance for read/write cycles.
5. Endurance: Offers high program/erase cycles, making it reliable for repeated use in applications.
6. Low Power Consumption: Designed for energy efficiency, ideal for battery-operated devices.
7. Temperature Range: Operates within a wide temperature range, suitable for automotive and industrial applications.
These features make the H26M51002KPR suitable for consumer electronics, smartphones, and IoT devices.
Package
Pinout
The main functions of the H26M51002KPR include:
1. Data Storage: It provides non-volatile memory for storing digital data even when power is turned off.
2. Read/Write Operations: It supports read, program, and erase operations, allowing data to be written and updated as needed.
3. Page and Block Management: The chip organizes data into pages and blocks, facilitating efficient data management and retrieval.
4. Interface Support: It communicates with the host system via a standard parallel interface, enabling integration with various devices.
This chip is known for its reliability and performance in handling memory-intensive applications.
Manufacturer
Application
Equivalent
- H26M51002GPR (similar specifications)
- H26M51001GPR (slightly different density)
- Micron MT29F512G08CBABA (NAND Flash)
- Samsung K9F1G08U0A (alternative NAND solution)
Always verify compatibility and specifications based on your specific application needs.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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