H26M64103EMR

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H26M64103EMR

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Spezifikationen

Manufacturer JLCPCB Assembly
Package FBGA-153_L13.0-W11.5

Übersicht

Description

H26M64103EMR is a type of DRAM (Dynamic Random Access Memory) chip, specifically designed for high-density memory applications. It typically features a 64Mb capacity and is organized in a 4M x 16 configuration, facilitating efficient data storage and retrieval. This memory chip is often used in telecommunications, consumer electronics, and computing devices where reliable and fast memory access is crucial.
Key specifications may include operating voltage, access time, and refresh rates, which are important for performance and power efficiency. The chip is generally manufactured using advanced semiconductor technologies, ensuring high speed and low power consumption.
H26M64103EMR is notable for its compatibility with various memory standards, making it suitable for integration in diverse electronic systems. It is essential for developers and engineers to refer to the chip's datasheet for detailed information on pin configurations, electrical characteristics, and application guidelines.

Features

The H26M64103EMR is a 4 Megabit (512 K x 8) flash memory device designed for various embedded applications. It features a compact design, supporting a wide voltage range (typically 2.7V to 3.6V), which allows for versatile usage in different electrical environments. Key features include:
- Access Speed: Offers fast read access times, typically around 70 ns.
- Data Retention: Ensures data retention for up to 20 years, making it reliable for long-term storage.
- Erase/Program Cycles: Supports a minimum of 10,000 erase/program cycles, suitable for frequent updates.
- Interface: Utilizes a standard parallel interface for easy integration into existing systems.
- Power Efficiency: Low power consumption in active and standby modes enhances battery life in portable applications.
- Temperature Range: Designed to operate in a wide temperature range, ensuring stability in diverse environments.
The H26M64103EMR is ideal for applications such as consumer electronics, automotive systems, and industrial devices, providing a balance of performance, reliability, and efficiency.

Package

The H26M64103EMR is typically available in a TSOP (Thin Small Outline Package) type. This package design allows for a compact footprint suitable for various electronic applications, optimizing space on printed circuit boards.

Pinout

The H26M64103EMR is a 64Mbit NAND Flash memory chip. It features a pin count of 48 pins. The primary functions of these pins include data input/output, control signals, power supply, and ground connections.
Key pin functions include:
- D0-D7: Data input/output lines used for transferring data.
- CLE (Command Latch Enable): Used to latch command inputs.
- ALE (Address Latch Enable): Used to latch address inputs.
- WE (Write Enable): Enables write operations.
- RE (Read Enable): Enables read operations.
- CE (Chip Enable): Activates the chip for read/write operations.
- WP (Write Protect): Provides write protection when high.
- RB (Ready/Busy): Indicates the status of the device.
This chip is often used in consumer electronics, mobile devices, and other applications requiring compact and efficient non-volatile storage.

Manufacturer

The H26M64103EMR is manufactured by Hynix Semiconductor, which is now known as SK Hynix Inc. SK Hynix is a South Korean multinational company that specializes in semiconductor manufacturing. It is one of the largest memory chip producers in the world, focusing on dynamic random-access memory (DRAM) and NAND flash memory products. Founded in 1983, the company has grown to be a significant player in the global semiconductor market, supplying memory solutions for various applications, including computers, smartphones, and servers. SK Hynix is known for its innovation and investment in research and development to advance memory technologies.

Application

The H26M64103EMR is a 64Mb (8MB) NOR Flash memory chip commonly used in embedded systems for applications such as consumer electronics, automotive, telecommunications, and industrial devices. It is suitable for code storage, firmware updates, and data retention due to its reliable performance and fast read speeds. Typical use cases include smartphones, tablets, digital cameras, and IoT devices where non-volatile memory is essential for storing critical data and software.

Equivalent

The H26M64103EMR chip, a 64Mbit DRAM, is equivalent to several other products including:
- Hynix HY57V641620
- Samsung K4S641632E
- Micron MT48LC4M16A2
- Winbond W9425G6JH
Always verify specifications and compatibility based on your specific application requirements.

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

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