H26M74002HMR

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H26M74002HMR

FBGA-153 Memory (ICs) RoHS

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Spezifikationen

Packaging FBGA-153

Übersicht

Description

H26M74002HMR is a high-density NAND Flash memory chip typically used in various electronic applications, including mobile devices, automotive systems, and consumer electronics. Manufactured by major semiconductor companies, it features a compact design and offers substantial storage capacity, making it suitable for applications requiring efficient data storage and retrieval.
This memory component supports various interfaces and protocols, ensuring compatibility with a wide range of devices. Its architecture often includes advanced error correction capabilities, enhancing data integrity and reliability. The H26M74002HMR is known for its durability and performance, making it a preferred choice for manufacturers looking to incorporate robust memory solutions into their products.
Overall, the H26M74002HMR exemplifies the advancements in flash memory technology, providing users with efficient, high-capacity storage to meet the demands of modern applications.

Features

The H26M74002HMR is a high-density memory chip designed for various applications, particularly in consumer electronics and embedded systems. Key features include:
1. Capacity: 2 Megabits (256 K x 8 bits) of memory storage.
2. Flash Technology: Utilizes NAND flash technology, providing non-volatile storage that retains data without power.
3. Access Speed: Offers fast read and write speeds, making it suitable for applications requiring quick data retrieval.
4. Low Power Consumption: Designed for energy efficiency, ideal for battery-operated devices.
5. Durability: High endurance with a significant number of write/erase cycles, enhancing longevity in frequent-use applications.
6. Interface: Provides a standard interface for easy integration into various systems.
7. Temperature Range: Supports a wide operating temperature range, ensuring reliability in different environments.
These features make the H26M74002HMR suitable for a variety of applications, including mobile devices, automotive systems, and other electronic products requiring reliable memory solutions.

Package

The H26M74002HMR is typically packaged in a TSOP (Thin Small Outline Package) form factor, which is designed for surface mounting on PCBs. This packaging helps reduce space and enables efficient thermal management.

Pinout

The H26M74002HMR is a 2Gb NAND Flash memory device with a pin count of 48. It is designed for various storage applications, including mobile devices, USB drives, and embedded systems. The primary functions of this device include data storage, read, and write operations. It features a NAND Flash architecture, offering high-density storage with efficient data management capabilities.
The pins are typically used for power supply, ground, control signals, data input/output, and address lines. Key functionalities include:
- Data I/O: for reading and writing data.
- Control Signals: to manage operations like chip enable (CE), write enable (WE), and output enable (OE).
- Address Lines: to specify memory locations for data access.
Overall, the H26M74002HMR is designed for high-performance applications requiring reliable, non-volatile memory storage.

Manufacturer

The H26M74002HMR is manufactured by Samsung Electronics. Samsung, a South Korean multinational conglomerate, is one of the world's largest technology companies, known for its diverse range of products, including semiconductors, consumer electronics, and telecommunications equipment. The company operates in various sectors, such as mobile devices, home appliances, and display technologies, and is recognized for its innovation in semiconductor manufacturing, specifically in memory chips like DRAM and NAND flash. Samsung Electronics is a subsidiary of the larger Samsung Group, which encompasses numerous affiliated businesses across multiple industries, including construction, shipbuilding, and financial services.

Application

The H26M74002HMR is a NAND flash memory chip primarily used in consumer electronics, including smartphones, tablets, and digital cameras. It is also applicable in industrial applications, automotive systems, and embedded devices for data storage and retrieval. Its features support high-speed data transfer and reliability, making it suitable for applications requiring efficient and durable memory solutions.

Equivalent

The H26M74002HMR chip is a NAND Flash memory, and equivalent products typically include other NAND Flash chips with similar capacities and specifications. Alternatives may include products from manufacturers like Micron (MT29F8G08ABAEAWP), Samsung (K9GAG08U0M), and Toshiba (TH58NVG7D2KL). Be sure to check datasheets for compatibility in terms of interface, voltage, and performance.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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