H5TQ4G63EFR-TEC

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H5TQ4G63EFR-TEC

4Gbit 1.425V~1.575V 1.066GHz DDR3 SDRAM FBGA-96 Memory (ICs) RoHS

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Spezifikationen

Packaging FBGA-96
Clock Frequency 1.066GHz
Memory Format DDR3 SDRAM
Memory Size 4Gbit
Operating temperature -40℃~+95℃
Voltage - Supply 1.425V~1.575V

Übersicht

Description

H5TQ4G63EFR-TEC is a type of DRAM (Dynamic Random Access Memory) chip produced by Hyundai. It falls within the DDR (Double Data Rate) memory category, specifically designed for high-performance computing applications. This memory module typically offers improved speed and efficiency compared to older DRAM technologies.
Key features include:
1. High Density: Supports large capacities, making it suitable for modern computing needs.
2. Data Rate: Provides faster data transfer rates, enhancing overall system performance.
3. Power Efficiency: Designed to consume less power, contributing to energy savings in devices.
Applications include laptops, desktops, servers, and other electronic devices that require rapid data processing and storage capabilities. The "TEC" in the designation may refer to specific technological enhancements or features that improve performance, thermal management, or reliability. Understanding its specifications is crucial for compatibility with motherboards and other hardware components in computer systems.

Features

The H5TQ4G63EFR-TEC is a high-performance 4GB DDR3 SDRAM (Synchronous Dynamic Random Access Memory) chip, typically used in various electronic devices, including smartphones, tablets, and computers. Key features include:
1. Density: 4GB capacity, suitable for multitasking and demanding applications.
2. Technology: DDR3, which offers improved speed and energy efficiency compared to its predecessor, DDR2.
3. Data Rate: Supports data rates of up to 1600 MT/s (megatransfers per second), ensuring fast data processing.
4. Operating Voltage: Operates at 1.5V, contributing to lower power consumption and enhanced battery life.
5. Form Factor: Available in a compact BGA (Ball Grid Array) package, facilitating easy integration into various circuit boards.
6. Temperature Range: Designed to operate within standard commercial temperature ranges, making it suitable for diverse applications.
Overall, the H5TQ4G63EFR-TEC is a reliable and efficient memory solution for modern electronic devices, balancing performance with energy efficiency.

Package

The H5TQ4G63EFR-TEC is a DRAM chip packaged in a 78-ball TFBGA (Thin Fine Pitch Ball Grid Array) format. This type of packaging is designed for compactness and efficient thermal management in electronic applications.

Pinout

The H5TQ4G63EFR-TEC is a 4Gb (Gigabit) DDR3 SDRAM memory chip produced by Hynix Semiconductor. It typically has a pin count of 78 pins.
### Pin Function:
- Data Pins (DQ0-DQ15): These pins are used for data input/output.
- Address Pins (A0-A12): These pins are used to select memory addresses.
- Control Pins (CLK, CK#, CS#, RAS#, CAS#, WE#): These pins manage the timing and control signals for memory operations.
- Power Pins (VDD, VSS): These provide power and ground connections.
- Miscellaneous Pins: Includes pins for reset (RESET#) and other specific functions related to the chip's operation.
This chip is commonly used in various applications requiring high-speed memory, such as in computers and other electronic devices.

Manufacturer

The H5TQ4G63EFR-TEC is manufactured by SK Hynix, a South Korean semiconductor company. SK Hynix is one of the largest memory chipmakers in the world, specializing in the production of DRAM (Dynamic Random Access Memory) and NAND flash memory. The company is known for its innovative technologies and high-quality products, serving a variety of markets, including consumer electronics, mobile devices, and servers. Founded in 1983, SK Hynix has grown to play a significant role in the global semiconductor industry, contributing to advancements in memory solutions and supporting a wide range of applications in computing and storage.

Application

The H5TQ4G63EFR-TEC is a 4Gb DDR3 DRAM memory chip commonly used in applications such as personal computers, laptops, servers, and networking equipment. It is suitable for mobile devices, consumer electronics, and gaming consoles, providing efficient data processing and storage capabilities. Its high-speed performance and low power consumption make it ideal for applications requiring rapid data access and multitasking.

Equivalent

The H5TQ4G63EFR-TEC chip is a 4Gb DDR3 SDRAM memory chip. Equivalent products include:
1. H5TQ4G63EFR-PBC
2. MT41K256M16HA-125
3. K4B4G1646E-BCTD
These alternatives may vary in specifications such as speed and power consumption, so verify compatibility for specific applications.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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