HMC558LC3B

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HMC558LC3B

IC MIXER FUNDAMENTAL 12SMD

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Spezifikationen

Part Status Obsolete
RF Type General Purpose
Frequency 5.5GHz ~ 14GHz
Number of Mixers 1
Noise Figure 8.5dB
Secondary Attributes Up/Down Converter
Mounting Type Surface Mount
Package / Case 12-VFCQFN Exposed Pad
Supplier Device Package 12-CSMT (3x3)
Base Product Number HMC558

Übersicht

Description

The HMC558LC3B is a versatile RF integrated circuit (IC) designed for various applications in telecommunications, including microwave and millimeter-wave systems. It functions as a high-performance analog mixer, capable of operating in the frequency range of 1 to 20 GHz.
Key features include low conversion loss, high linearity, and excellent port-to-port isolation, making it suitable for both upconversion and downconversion tasks. The device's compact 3x3 mm LFCSP (Lead Frame Chip Scale Package) footprint allows for easy integration into space-constrained environments.
With a typical input power handling capability and low noise figure, the HMC558LC3B can be effectively utilized in applications such as satellite communications, point-to-point radio, and radar systems. Its efficiency and reliability make it a popular choice for engineers looking to design high-frequency RF systems with stringent performance requirements.
Overall, the HMC558LC3B offers a robust solution for modern RF applications, combining performance with ease of use and integration.

Features

The HMC558LC3B is a high-frequency GaAs MMIC (Monolithic Microwave Integrated Circuit) amplifier designed for applications in the frequency range of 5 to 20 GHz. Key features include:
1. Gain: Provides a gain of 20 dB, ensuring strong signal amplification.
2. Noise Figure: Low noise figure of around 3 dB, enhancing signal clarity.
3. Output Power: Delivers an output power of +15 dBm, suitable for various communication needs.
4. Supply Voltage: Operates with a single supply voltage ranging from +5V to +8V.
5. Package: Available in a compact 3x3 mm LFCSP (Lead Frame Chip Scale Package) for space-constrained applications.
6. Impedance: Matched input and output impedances of 50 ohms, simplifying integration into systems.
7. Wideband Performance: Effective across a broad frequency range, making it versatile for RF and microwave applications.
These features make the HMC558LC3B suitable for use in radar, satellite communications, and other high-frequency systems.

Package

The HMC558LC3B is packaged in a 16-lead LFCSP (Lead Frame Chip Scale Package), which is a compact, surface-mount package designed for high-frequency applications. This package type features a small footprint and excellent thermal performance.

Pinout

The HMC558LC3B is a microwave integrated circuit (IC) from Analog Devices, specifically designed as a low-noise amplifier (LNA). It features a total of 8 pins.
The pin functions are as follows:
1. RF In: Input for the RF signal.
2. RF Out: Output for the amplified RF signal.
3. Vgg: Gate voltage control for biasing.
4. Vdd: Power supply voltage input.
5. GND: Ground connection.
6. NC: No Connect (not internally connected).
7. Rbias: Resistor for biasing configuration.
8. Vdd2: Additional power supply input for further amplification stages.
This IC is optimized for use in applications like microwave and RF communication systems, providing low noise figure and high gain performance in the specified frequency range.

Manufacturer

The HMC558LC3B is manufactured by Analog Devices, Inc. (ADI), a leading semiconductor company specializing in high-performance analog, mixed-signal, and digital signal processing (DSP) technologies. Founded in 1965, Analog Devices develops innovative solutions for a variety of applications, including communications, automotive, industrial, and consumer electronics. The company's products are widely used in signal processing, data conversion, and power management. ADI is recognized for its commitment to quality and performance in the semiconductor industry, making it a key player in advancing technology across multiple sectors.

Application

The HMC558LC3B is a high-performance RF switch used in applications such as wireless communication systems, satellite communication, and radar systems. It is ideal for use in signal routing, antenna switching, and transceiver applications, particularly in mobile and base station equipment. Its low insertion loss and high isolation make it suitable for both transmit and receive paths in RF circuits.

Equivalent

The HMC558LC3B is a high-performance RF amplifier. Equivalent products include the HMC558LP3E, HMC558LP3B, and other similar RF amplifiers from manufacturers like Analog Devices, Qorvo, or Mini-Circuits that offer comparable gain, frequency range, and linearity. Always check specific datasheets for detailed specifications to ensure compatibility.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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