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IDH10G65C6
SiC Schottky Diodes SIC DIODES
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- Fr. Teil #IDH10G65C6
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- Datenblatt IDH10G65C6 DataSheet
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Übersicht
Description
This device is characterized by its low on-resistance (R_DS(on)), which enhances efficiency by minimizing power loss during operation. Its fast switching capabilities allow for rapid turn-on and turn-off, resulting in improved performance in high-frequency applications. Additionally, the IDH10G65C6 typically comes in a TO-220 package, which aids in heat dissipation and allows for easier integration into circuit designs.
With a maximum gate-source voltage (V_GS) rating, it can be driven by standard PWM controllers, making it versatile in various applications ranging from industrial to consumer electronics. Overall, the IDH10G65C6 is a reliable choice for engineers seeking efficient solutions in high-voltage power management.
Features
1. Voltage Rating: It can handle a maximum drain-source voltage (Vds) of 650V.
2. Current Rating: The maximum continuous drain current (Id) is around 10A, depending on the thermal conditions.
3. RDS(on): It has a low on-resistance, typically around 0.8 Ohm, which reduces power losses during operation.
4. Gate Threshold Voltage: The gate threshold voltage (Vgs(th)) ranges from 2V to 4V, making it suitable for low-voltage drive applications.
5. Fast Switching: Designed for fast switching applications, helping to improve efficiency in power conversion circuits.
6. Package Type: Available in a DPAK package, which aids in thermal management and PCB layout flexibility.
7. Applications: Commonly used in power supplies, converters, and motor drives due to its excellent performance characteristics.
These features make the IDH10G65C6 ideal for various high-voltage, low-loss applications.
Package
Pinout
1. Gate (G): This pin is used for controlling the turn-on and turn-off of the IGBT.
2. Collector (C): This is the main current-carrying terminal where the output is connected.
3. Emitter (E): This pin is connected to the ground or negative side of the circuit.
4. Freewheeling Diode (D): Integrated for providing a path for inductive loads when the IGBT is turned off.
5. Thermal Pad: For heat dissipation, often used for mounting to help manage thermal performance.
6. External connections: May include additional pins for protection or sensing.
Always refer to the specific datasheet for detailed pin configuration and electrical characteristics.
Manufacturer
Application
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