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IPB200N25N3G
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Spezifikationen
| Manufacturer | Infineon Technologies |
| Package | TO-263-3 |
| Operating Temperature | -55℃~+175℃ |
| RDS(on) | 20mΩ@10V,64A |
| Drain to Source Voltage | 250V |
| Pd - Power Dissipation | 300W |
| Current - Continuous Drain(Id) | 64A |
| Reverse Transfer Capacitance (Crss@Vds) | 395pF |
| Input Capacitance(Ciss@Vds) | 7.1nF |
| Gate Threshold Voltage (Vgs(th)@Id) | 4V |
| Gate Charge(Qg) | 64nC@10V |
| Number | 1 N-channel |
Übersicht
Description
Key features of the IPB200N25N3G include its low on-resistance (Rds(on)), which minimizes power loss and enhances efficiency, particularly in high-frequency operations. The device also offers a fast switching speed, making it ideal for applications where rapid response is required.
Additionally, its rugged construction allows it to withstand high temperatures and conditions typically found in industrial settings. The package type is typically TO-220, which facilitates easy thermal management and mounting. Overall, the IPB200N25N3G is a reliable choice for engineers seeking efficient and robust MOSFET solutions in their designs.
Features
1. Voltage Rating: It has a maximum drain-source voltage (V_DS) of 250V, making it suitable for high-voltage applications.
2. Current Handling: It can handle a continuous drain current (I_D) of up to 200A at a case temperature of 25°C, allowing for robust performance in demanding environments.
3. On-Resistance: The device boasts a low on-resistance (R_DS(on)) of around 0.025 ohms, which minimizes power loss and improves thermal efficiency.
4. Fast Switching: It features rapid switching capabilities, ideal for applications like power supplies, converters, and motor drivers.
5. Thermal Performance: Designed for efficient heat dissipation with a high maximum junction temperature (T_J), enhancing reliability.
6. Package Type: Available in a TO-247 package, facilitating easy mounting and thermal management.
Overall, the IPB200N25N3G is well-suited for applications requiring high power efficiency and performance in power electronics.
Package
Pinout
1. Gate (G) - Controls the switching of the MOSFET.
2. Drain (D) - The terminal through which current flows out of the device.
3. Source (S) - The terminal through which current flows into the device.
4. Substrate (B) - Often internally connected to the source; used for thermal management and to prevent parasitic effects.
This MOSFET is designed for high-efficiency power applications, featuring low on-resistance (RDS(on)) and high breakdown voltage. It is commonly used in power management circuits, switching power supplies, and motor control applications.
Manufacturer
Application
Equivalent
Versand
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bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
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2. Kredit- / Debitkarte
3. Überweisung
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