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IRFS7530TRLPBF
MOSFET N CH 60V 195A D2PAK
- Hersteller
- Fr. Teil #IRFS7530TRLPBF
- Paket TO-263-3,D2PAK(2Leads+Tab),TO-263AB
- Datenblatt IRFS7530TRLPBF DataSheet
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Spezifikationen
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Series | HEXFET®, StrongIRFET™ |
| ProductStatus | Active |
| FETType | N-Channel |
| Technology | MOSFET (Metal Oxide) |
| DraintoSourceVoltage(Vdss) | 60 V |
| Current-ContinuousDrain(Id)@25°C | 195A (Tc) |
| DriveVoltage(MaxRdsOnMinRdsOn) | 6V, 10V |
| RdsOn(Max)@IdVgs | 2mOhm @ 100A, 10V |
| Vgs(th)(Max)@Id | 3.7V @ 250µA |
| GateCharge(Qg)(Max)@Vgs | 411 nC @ 10 V |
| Vgs(Max) | ±20V |
| InputCapacitance(Ciss)(Max)@Vds | 13703 pF @ 25 V |
| PowerDissipation(Max) | 375W (Tc) |
| OperatingTemperature | -55°C ~ 175°C (TJ) |
| MountingType | Surface Mount |
| SupplierDevicePackage | PG-TO263-2 |
Übersicht
Description
Key specifications include a maximum drain-source voltage (VDS) of 30V, a continuous drain current (ID) of up to 75A, and a low RDS(on) value, which enhances thermal performance and efficiency. Its fast switching capabilities minimize energy loss during operation, and it is packaged in a TO-220 form factor, allowing for effective heat dissipation.
The IRFS7530TRLPBF is also RoHS compliant, indicating that it meets environmental standards concerning hazardous materials. It is widely used in automotive, industrial, and consumer electronics due to its reliability and performance under high thermal and electrical stress. Overall, this MOSFET is suitable for designers looking to optimize efficiency in power applications.
Features
- Low On-Resistance (RDS(on)): Typically around 3.6 mΩ, which minimizes conduction losses.
- High Voltage Rating: Supports a maximum drain-source voltage (VDS) of 30V, making it suitable for various power applications.
- High Current Capacity: It can handle continuous drain current (ID) up to 70A, allowing for robust performance in demanding environments.
- Fast Switching Speed: Designed for rapid switching, which enhances performance in high-frequency operations.
- Thermal Management: Offers a low thermal resistance, aiding in effective heat dissipation.
- Package Type: Available in a surface-mount DPAK package for efficient thermal and electrical performance.
These features make the IRFS7530TRLPBF ideal for applications such as DC-DC converters, motor drivers, and other power management systems.
Package
Pinout
The pin configuration is as follows:
1. Gate (G) - Controls the MOSFET's switching.
2. Drain (D) - The output terminal where the load is connected.
3. Source (S) - The terminal that connects to ground or the negative side of the circuit.
The device is designed for applications such as DC-DC converters, motor drives, and other power management circuits. Its robust specifications make it suitable for high-efficiency designs. The TRLPBF suffix indicates that it is available in a surface mount package (TLP) and is lead-free (Pb-free).
Manufacturer
Application
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Versand
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Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
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