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IS43DR16320E-25DBLI
IC DRAM 512MBIT PAR 84TWBGA
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- Fr. Teil #IS43DR16320E-25DBLI
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Spezifikationen
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - DDR2 |
| Memory Size | 512Mbit |
| Memory Organization | 32M x 16 |
| Memory Interface | Parallel |
| Write Cycle Time - Word, Page | 15ns |
| Voltage - Supply | 1.7V ~ 1.9V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 84-TFBGA |
| Supplier Device Package | 84-TWBGA (8x12.5) |
| Base Product Number | IS43DR16320 |
| Clock Frequency | 400 MHz |
| Access Time | 400 ps |
Übersicht
Description
This DRAM is built using advanced 25nm technology, which enhances its efficiency and performance while reducing power consumption. It operates on a 3.3V power supply and includes features like a burst mode for improved data transfer rates. The “-BLI” suffix typically indicates a specific package type or grade, often denoting a lead-free, environmentally friendly option.
The IS43DR16320E-25DBLI is ideal for embedded systems and applications requiring reliable, high-speed memory, making it a popular choice among engineers and designers in the electronics industry.
Features
1. Memory Type: DDR3 SDRAM
2. Capacity: 2 Gigabits (GB)
3. Configuration: 1 x 16 bits
4. Speed: Operates at a data rate of up to 1600 MT/s (Mega Transfers per second)
5. Voltage: Operates at a core voltage of 1.5V, with support for 1.35V for low-power applications.
6. Package: 78-ball FBGA (Fine Ball Grid Array), making it suitable for compact designs.
7. Timing: CL=25 for improved efficiency in data access times.
8. Features: Supports burst lengths of 4 and 8, along with an asynchronous reset for enhanced flexibility.
9. Applications: Ideal for use in various computing devices, including laptops, desktops, and other embedded systems.
This chip effectively balances performance, power consumption, and form factor, making it a solid choice for modern memory needs.
Package
Pinout
1. Data Pins (DQ0-DQ15): These are used for data input and output.
2. Address Pins (A0-A12): These are used to select memory locations.
3. Control Pins (CS, RAS, CAS, WE): Control signals for enabling the chip, row address strobe, column address strobe, and write enable.
4. Clock Pins (CLK, CLK#): Used for synchronizing data transfers.
5. Power Pins (VDD, VSS): Provide power supply and ground.
6. Chip Select Pins (CS): Used for chip enable/disable functionality.
7. Byte Enable Pins (BYTE): Allow control over data access in byte format.
This DRAM operates with a 25 ns access time and is designed for high-performance applications.
Manufacturer
Application
Equivalent
1. Hynix H5TQ2G63AFR
2. Micron MT41J128M16HA
3. Samsung K4B4G1646D
4. Nanya NT5CB256M16DP
Ensure to verify specifications like speed, package type, and voltage before substituting.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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