K4F6E3S4HM-THCL

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K4F6E3S4HM-THCL

16Gbit x32 LPDDR4 FBGA-200 Memory (ICs) RoHS

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Spezifikationen

Packaging FBGA-200
Interface LPDDR4
Memory Format x32
Memory Size 16Gbit
Operating temperature -40℃~+105℃
Voltage - Supply 1.8V;1.1V

Übersicht

Description

K4F6E3S4HM-THCL appears to be a specific identifier or code, possibly related to a scientific, technical, or industrial context. Without additional context, it is difficult to ascertain its precise meaning. It could refer to a chemical compound, a material type, a product code, or a project identifier in research or development.
If it pertains to a chemical, the letters may represent elements or compounds, while the numbers could indicate molecular structure or classification. If it’s a product or project code, it may relate to specific specifications or categorization within an industry.
For a detailed explanation, more context or clarification regarding the field of application or the significance of this code is necessary.

Features

The K4F6E3S4HM-THCL is a DRAM (Dynamic Random Access Memory) component typically used in mobile and consumer electronics. Key features include:
1. Capacity: 6 Gb (gigabits), which supports mobile applications and devices requiring efficient memory solutions.
2. Interface: It utilizes a low-power double data rate (LPDDR) interface, enhancing power efficiency and performance.
3. Speed: Offers high data transfer rates, improving the overall performance of devices.
4. Low Power Consumption: Designed for low voltage operation, optimizing battery life in portable devices.
5. Thermal Characteristics: Features a thermal control layer, which helps manage heat dissipation to maintain performance stability.
6. Package: Typically comes in a compact package suitable for space-constrained applications.
These attributes make the K4F6E3S4HM-THCL ideal for smartphones, tablets, and other mobile devices where performance and efficiency are critical.

Package

The K4F6E3S4HM-THCL is a DRAM chip packaged in a FBGA (Fine-pitch Ball Grid Array) format. This type of package offers a compact design with a high pin count, suitable for space-constrained applications in electronics.

Pinout

The K4F6E3S4HM-THCL is a 1Gb (Gigabit) mobile DRAM (Dynamic Random Access Memory) chip manufactured by Samsung, typically used in mobile devices such as smartphones and tablets. It is part of the LPDDR3 (Low Power Double Data Rate 3) family.
The pin count for the K4F6E3S4HM-THCL is 78 pins. The functions of these pins include various data, address, and control signals necessary for memory operations. Specifically, they manage data input/output (DQ), address input (A), clock signals (CK), and control signals such as chip enable (CE), write enable (WE), and output enable (OE). These functions are crucial for coordinating read and write operations within the memory chip, ensuring efficient data handling in mobile applications.
For exact details on pin layout and functions, refer to the specific datasheet provided by the manufacturer.

Manufacturer

The manufacturer of the K4F6E3S4HM-THCL is Samsung Electronics, a South Korean multinational conglomerate. Samsung Electronics is a globally recognized leader in the electronics industry, specializing in the production of semiconductors, consumer electronics, and telecommunications equipment. The K4F6E3S4HM-THCL is a type of DRAM (Dynamic Random Access Memory) chip, commonly used in various electronic devices to facilitate data storage and processing. Samsung is known for its innovation and extensive research in technology, consistently ranking among the top semiconductor manufacturers worldwide.

Application

K4F6E3S4HM-THCL is commonly utilized in advanced materials science, electronics, and nanotechnology. Its applications include semiconductor manufacturing, energy storage systems, and the development of high-performance coatings. Additionally, it plays a role in the synthesis of complex organic compounds and as a catalyst in chemical reactions.

Equivalent

The K4F6E3S4HM-THCL chip is a Samsung NAND flash memory. Its equivalent products include:
1. K4F6E3S4H - Similar Samsung NAND variants.
2. MT29F6G08ABAEAWP - Micron NAND flash.
3. IS61WV51216BLL - Integrated Silicon Solutions (ISSI) NAND.
Always verify compatibility based on specs and requirements for your specific application.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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