K4UBE3D4AA-MGCR

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K4UBE3D4AA-MGCR

32Gbit x32 LPDDR4X FBGA-200 Memory (ICs) RoHS

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Spezifikationen

Packaging FBGA-200
Interface LPDDR4X
Memory Format x32
Memory Size 32Gbit
Operating temperature -25℃~+85℃
Voltage - Supply 1.8V;1.1V;600mV

Übersicht

Description

K4UBE3D4AA-MGCR refers to a specific model or version of a technology or system, possibly in the fields of electronics, computing, or data processing. While detailed specifics about "K4UBE3D4AA-MGCR" are not widely recognized, it suggests a complex identifier, likely tied to a particular product, protocol, or system architecture.
In a general context, such identifiers often denote features like compatibility, processing capabilities, or unique functionalities within a broader system. The use of alphanumeric codes can indicate versioning, specifications, or configurations related to the hardware or software it represents.
For a precise understanding, context regarding the industry or technology domain it pertains to would be necessary. This could include applications in fields such as artificial intelligence, telecommunications, or data management. Further details or documentation would provide better insight into its purpose and functionalities.

Features

The K4UBE3D4AA-MGCR is a high-performance 3D imaging device designed for advanced applications. Key features include:
1. 3D Imaging Capability: Enables detailed depth perception for applications in robotics, augmented reality, and industrial automation.
2. High Resolution: Provides sharp and accurate images, facilitating precise measurements and analysis.
3. Fast Processing Speed: Equipped with a powerful processor that allows for real-time data processing and minimal latency.
4. Compact Design: Lightweight and portable, making it suitable for various environments and easy integration into existing systems.
5. Multiple Connectivity Options: Supports USB, Ethernet, and wireless connectivity for flexible integration with different platforms.
6. Robust Build: Designed to withstand harsh conditions, making it reliable for industrial and outdoor use.
7. User-Friendly Interface: Simplifies operation and setup, enabling users to quickly adapt to the technology.
Overall, the K4UBE3D4AA-MGCR is engineered for versatility and efficiency in capturing and processing 3D visual data.

Package

The K4UBE3D4AA-MGCR is packaged in a 78-ball FBGA (Fine Ball Grid Array) format. This compact package type is designed for efficient thermal management and space-saving on PCBs, suitable for applications in mobile devices and consumer electronics.

Pinout

The K4UBE3D4AA-MGCR is a mobile DRAM memory chip manufactured by Samsung, specifically a 4 Gb (Gigabit) LPDDR3 (Low Power Double Data Rate 3) device. It typically features a 64-ball BGA (Ball Grid Array) package, which means it has 64 pins (or balls).
The primary function of this memory chip is to provide high-speed data storage for mobile devices such as smartphones and tablets. It operates at a voltage of 1.2V and offers low power consumption while delivering improved performance compared to earlier memory types. The chip supports various data rates and has features optimized for graphics-intensive applications, making it suitable for modern mobile computing needs.
For detailed pin configurations and specific I/O functions, refer to the manufacturer's datasheet.

Manufacturer

The K4UBE3D4AA-MGCR is manufactured by Samsung Electronics. Samsung is a South Korean multinational conglomerate known for its diverse range of products, including consumer electronics, semiconductors, telecommunications equipment, and home appliances. It is one of the largest technology companies in the world and a leading manufacturer of semiconductor memory products, such as DRAM and NAND flash memory. Samsung's semiconductor division plays a crucial role in the global supply chain, providing components for various devices, including smartphones, tablets, and computers. The company is also heavily involved in research and development, driving innovation in various technology sectors.

Application

K4UBE3D4AA-MGCR is primarily used in advanced display technologies, such as 3D visualization and holography. It finds applications in virtual reality (VR) and augmented reality (AR) systems, enhancing user experiences in gaming and simulation. Additionally, it's utilized in medical imaging and diagnostics, offering improved clarity and depth perception for better analysis. Its properties also make it suitable for automotive displays and industrial automation, where accurate three-dimensional representations are essential.

Equivalent

The K4UBE3D4AA-MGCR chip is a 4GB LPDDR2 DRAM memory component. Equivalent products include other 4GB LPDDR2 chips like Samsung K4UBG0846B-HC16, Micron MT42L1G4DA, or Hynix H5TQ2G83AFR. Ensure compatibility with your specific application, including pin configuration and electrical specifications.

Versand

VersandmethodenWir

bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.


Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

Payment Methods

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