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MT29F2G16ABBEAHC-AIT:E TR
NAND Flash SLC 2G 128MX16 FBGA
- Hersteller
- Fr. Teil #MT29F2G16ABBEAHC-AIT:E TR
- Paket
- Datenblatt MT29F2G16ABBEAHC-AIT:E TR DataSheet
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Spezifikationen
| Packaging | MouseReel |
| Standard Pack Qty | 1000 |
Übersicht
Description
Operating with a serial interface, this NAND flash supports asynchronous and synchronous modes, providing flexibility in data transfer rates. The chip is built using advanced 3D NAND technology, which improves reliability and endurance compared to traditional planar NAND. It supports features such as wear leveling and bad block management, which are essential for maintaining data integrity over time.
The “-AIT” designator indicates specific temperature and performance characteristics, while “TR” denotes that the product is supplied in tape and reel packaging for automated assembly processes. Overall, this NAND flash memory chip is suitable for applications requiring high-density storage with efficient performance.
Features
1. Density: 2 Gb (Gigabits) capacity.
2. Interface: Supports ONFI (Open NAND Flash Interface) for interoperability with various host controllers.
3. Form Factor: Typically available in a small BGA (Ball Grid Array) package for compact designs.
4. Speed: Offers high read and write speeds, suitable for fast data access and storage.
5. Endurance: Designed for multiple program/erase cycles, enhancing longevity for demanding applications.
6. Power Management: Low power consumption modes to extend battery life in portable devices.
7. Reliability: Incorporates error correction features for data integrity and reliability.
8. Operating Temperature: Supports a wide temperature range, making it suitable for industrial applications.
This chip is ideal for use in consumer electronics, automotive systems, and industrial applications requiring robust and efficient flash memory solutions.
Package
Pinout
1. Data Pins (DQ0-DQ15): These 16 pins are used for data input and output.
2. Command/Address Pins (CMD, ADDR): Pins for command and address input.
3. Chip Enable (CE): Used to enable the chip.
4. Write Protect (WP): Provides write protection functionality.
5. Ready/Busy (R/B): Indicates when the device is ready for the next command.
6. Ground (GND): Provides the ground reference.
7. Power (VCC, VCCQ): Power supply pins for the device.
8. NAND Flash specific pins (RE, WE): Control read and write operations.
This device is commonly used in applications requiring storage solutions such as smartphones, tablets, and other embedded systems.
Manufacturer
Application
Equivalent
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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