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MT29F8G16ADBDAH4-IT:D
IC FLASH 8GBIT PARALLEL 63VFBGA
- Hersteller
- Fr. Teil #MT29F8G16ADBDAH4-IT:D
- Paket VFBGA-63
- Datenblatt
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Spezifikationen
| Package | Bulk |
| ProductStatus | Obsolete |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NAND |
| MemorySize | 8Gb (512M x 16) |
| MemoryInterface | Parallel |
| Voltage-Supply | 1.7V ~ 1.95V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 63-VFBGA |
Übersicht
Description
Key features include a 1.8V operating voltage, multi-level cell (MLC) architecture, and support for various data transfer protocols. Its compact form factor allows for easy integration into various designs, while its low power consumption makes it suitable for battery-operated devices. Additionally, the device is designed for high endurance and performance, making it ideal for both consumer and industrial applications.
Overall, the MT29F8G16ADBDAH4-IT:D is a versatile memory solution that balances performance, density, and efficiency for modern digital applications.
Features
- Density: 8 Gigabits (1 GB).
- Architecture: SLC (Single-Level Cell) for enhanced reliability and endurance.
- Interface: ONFI (Open NAND Flash Interface) compliant for compatibility and performance.
- Package: Offered in a compact BGA (Ball Grid Array) package, which is suitable for various applications.
- Operating Voltage: Typically operates at 3.3V, with low power consumption characteristics.
- Read/Write Performance: High-speed data transfer rate, making it ideal for applications requiring fast access.
- Endurance: Supports a high number of program/erase cycles, suitable for demanding applications.
- Applications: Commonly used in mobile devices, solid-state drives (SSDs), and embedded systems.
This NAND Flash memory is designed to offer a balance of performance, endurance, and efficiency, making it suitable for a variety of storage applications.
Package
Pinout
The key functions of these pins include:
1. Data Pins (DQ0-DQ7): 8 data pins for input/output operations.
2. Address Pins (A0-A20): Used to select specific memory locations.
3. Control Pins:
- WE: Write Enable, controls write operations.
- RE: Read Enable, controls read operations.
- CE: Chip Enable, activates the device.
- ALE: Address Latch Enable, latches address information.
- CLE: Command Latch Enable, latches command information.
4. WP: Write Protect, for protecting data from being overwritten.
5. R/B: Ready/Busy, indicates the status of the device.
This configuration allows for efficient data storage, retrieval, and management in embedded systems.
Manufacturer
Application
Equivalent
1. Hynix H27QCG8T2D1 - a similar NAND flash memory.
2. Samsung K9GAG08U0M - another alternative NAND solution.
3. Toshiba TC58NVG2S0H - comparable NAND flash memory.
Always check datasheets for specific compatibility and specifications before substitution.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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