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MT47H64M16NF-25E:M
IC DRAM 1GBIT PARALLEL 84FBGA
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- Fr. Teil #MT47H64M16NF-25E:M
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Spezifikationen
| Part Status | Active |
| Base Product Number | MT47H64M16 |
| DigiKey Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - DDR2 |
| Memory Size | 1Gbit |
| Memory Organization | 64M x 16 |
| Memory Interface | Parallel |
| Clock Frequency | 400 MHz |
| Write Cycle Time - Word, Page | 15ns |
| Voltage - Supply | 1.7V ~ 1.9V |
| Operating Temperature | 0°C ~ 85°C (TC) |
| Mounting Type | Surface Mount |
| Package | 84-TFBGA |
| Supplier Device Package | 84-FBGA (8x12.5) |
| Packaging | Tray |
| Access Time | 400 ps |
Übersicht
Description
Key features include a 1.5V core voltage, 8-byte wide data bus, and a standard 78-ball BGA (Ball Grid Array) package. The "25E" in the part number indicates a specific process technology, contributing to its performance characteristics. The chip supports various operations such as random access, burst mode, and various refresh cycles, ensuring reliable data storage and retrieval.
MT47H64M16NF-25E is widely used in consumer electronics, telecommunications, and computing devices where efficient memory solutions are essential.
Features
1. Density: 1GB (64 Meg x 16-bit organization).
2. Speed: Operates at a data rate of up to 1600 MT/s (megatransfers per second).
3. Voltage: Operates at a low voltage of 1.5V, promoting energy efficiency.
4. Architecture: Supports an 8-bit prefetch architecture, which enhances data transfer rates.
5. Package: Available in a JEDEC-standard 78-ball FBGA (Fine Ball Grid Array) package.
6. Latency: Offers various CAS latency options, typically CL11 or CL13.
7. Temperature Range: Supports industrial temperature ranges, suitable for various applications.
8. Applications: Commonly used in consumer electronics, computing devices, and embedded systems due to its reliability and performance.
These features make the MT47H64M16NF-25E suitable for applications requiring fast and efficient memory solutions.
Package
Pinout
The primary functions of the chip include data storage, buffering, and quick access in computing applications. It features a standard DDR3 interface, allowing for high-speed data transfer and reduced power consumption compared to its predecessors. The chip supports various memory commands including read, write, and refresh operations while being optimized for use in both consumer electronics and industrial applications. The "25E" in the part number denotes the speed grade, indicating a maximum clock frequency of 800 MHz.
This device is typically used in applications such as laptops, desktops, and servers where high-density memory solutions are required.
Manufacturer
Application
Equivalent
1. Hynix H5TQ2G83EFR
2. Samsung K4B4G1646F
3. Micron MT41K256M16HA
Always verify specifications and compatibility for your specific application before use.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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