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MT48LC16M16A2P-6A IT:G
3V~3.6V 256Mbit 167MHz TSOP-54-10.2mm Memory (ICs) RoHS
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- Fr. Teil #MT48LC16M16A2P-6A IT:G
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Spezifikationen
| Packaging | TSOP-54-10.2mm |
| Clock Frequency | 167MHz |
| Memory Size | 256Mbit |
| Operating temperature | -40℃~+85℃ |
| Voltage - Supply | 3V~3.6V |
Übersicht
Description
Key features include:
- Architecture: 16 Meg x 16 bit organization.
- Operating Voltage: Typically operates at 3.3V.
- Temperature Range: Industrial-grade (IT) version supports a temperature range of -40°C to +85°C.
- Package Type: Available in a standard TSOP-II package, facilitating easy integration into systems.
- Data Rates: Designed for synchronous operation, supporting burst mode and interleaved access.
The MT48LC16M16A2P-6A IT:G is commonly used in applications such as networking, telecommunications, and industrial systems where reliability and performance are critical.
Features
1. Density: 256 Megabits organized as 16 Megabytes x 16 bits.
2. Speed: Operates at a clock frequency of 166 MHz, with a data rate of 333 MT/s.
3. Low Power: IT (Industrial Temperature) grade supports a wide temperature range, typically from -40°C to +95°C, making it suitable for industrial applications.
4. Architecture: It employs a double-data-rate architecture, providing higher bandwidth by transferring data on both rising and falling edges of the clock signal.
5. Interface: The chip features a synchronous interface, which allows for burst accesses to improve performance.
6. Package: Available in a 54-ball FBGA (Fine Ball Grid Array) package for compact designs.
7. Power Supply: Operates at 2.5V for core and 1.8V for I/O.
These features make the MT48LC16M16A2P-6A IT:G suitable for various applications in telecommunications, networking, and industrial environments.
Package
Pinout
1. Address Inputs (A0-A11): Used for selecting memory locations.
2. Data Inputs/Outputs (DQ0-DQ15): Used for data transfer.
3. Chip Select (CS): Activates the chip for read/write operations.
4. Row Address Strobe (RAS): Used to latch the row address.
5. Column Address Strobe (CAS): Used to latch the column address.
6. Write Enable (WE): Controls write operations.
7. Byte Select (UB, LB): Used for selecting upper or lower bytes during data operations.
8. Clock (CLK): Synchronizes operations.
9. Power (VDD, VSS): Supplies power to the chip.
This DRAM is designed for high-performance applications and features low power consumption, making it suitable for various electronic devices.
Manufacturer
Application
Equivalent
1. Hynix HY57V161620C
2. Samsung K4S161622D
3. Elpida EDE5116B2A
4. Micron MT48LC16M16A2P-6A
Ensure compatibility with specifications, such as speed, voltage, and pin configuration, when considering substitutes.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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