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MT48LC16M16A2P-75:D
IC DRAM 256MBIT PAR 54TSOP II
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Spezifikationen
| Part Status | Obsolete |
| Base Product Number | MT48LC16M16A2 |
| DigiKey Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM |
| Memory Size | 256Mbit |
| Memory Organization | 16M x 16 |
| Memory Interface | Parallel |
| Clock Frequency | 133 MHz |
| Write Cycle Time - Word, Page | 15ns |
| Voltage - Supply | 3V ~ 3.6V |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Mounting Type | Surface Mount |
| Package | 54-TSOP (0.400", 10.16mm Width) |
| Supplier Device Package | 54-TSOP II |
| Packaging | Tray |
| Access Time | 5.4 ns |
Übersicht
Description
This chip is designed for applications requiring high-density memory solutions, commonly used in mobile devices, networking equipment, and consumer electronics. It features a double data rate (DDR) interface, enhancing data throughput by transferring data on both the rising and falling edges of the clock signal.
The MT48LC16M16A2P-75:D is part of the DRAM family that supports various power-saving features and operates on a 3.3V power supply, making it suitable for low-power applications. Its robust design and compatibility with industry standards make it a popular choice for various embedded systems and memory-intensive applications.
Features
1. Type: DDR SDRAM (Double Data Rate Synchronous Dynamic Random Access Memory).
2. Density: 256 Megabits.
3. Data Width: 16 bits.
4. Organization: x16 configuration.
5. Speed: Operates at a clock speed of 75ns (0.75ns data rate).
6. Voltage: Typically operates at 2.5V.
7. Package Type: Available in a variety of packages, commonly a 54-ball FBGA (Fine Ball Grid Array).
8. Burst Length: Supports burst transactions for efficient data access.
9. Refresh: Requires periodic refresh cycles to maintain data integrity.
10. Applications: Suitable for use in various applications including networking, telecommunications, and consumer electronics.
This DRAM is designed for high performance and efficiency in data processing tasks.
Package
Pinout
Pin Functions:
1. Address Pins (A0-A11, BA0, BA1): Used for addressing memory locations.
2. Data Pins (DQ0-DQ15): IO pins for data input/output.
3. Control Pins (WE, CAS, RAS): Control the read/write operations and memory access timing.
4. Clock Pin (CLK): Synchronizes data transfers.
5. Power Supply Pins (VDD, VSS): Provide power to the chip; VDD is the power supply and VSS is the ground.
6. Others: Various pins for chip enable (CS), output enable (OE), and other functions.
This device operates with a 75 ns access time and is often used in applications requiring high-density memory solutions.
Manufacturer
Application
Equivalent
1. Hynix HY57V281620DTP
2. Samsung K4S641632H
3. Micron MT48LC16M16A2P-75
4. Nanya NT5CB256M16HR-75
Ensure compatibility with voltage, timing, and other specifications when selecting alternatives.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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