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MT48LC4M32B2P-7:G
IC DRAM 128MBIT PAR 86TSOP II
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Spezifikationen
| Part Status | Obsolete |
| Base Product Number | MT48LC4M32B2 |
| DigiKey Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM |
| Memory Size | 128Mbit |
| Memory Organization | 4M x 32 |
| Memory Interface | Parallel |
| Clock Frequency | 143 MHz |
| Write Cycle Time - Word, Page | 14ns |
| Voltage - Supply | 3V ~ 3.6V |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Mounting Type | Surface Mount |
| Package | 86-TFSOP (0.400", 10.16mm Width) |
| Supplier Device Package | 86-TSOP II |
| Packaging | Tray |
| Access Time | 5.5 ns |
Übersicht
Description
The "4M32" signifies that the chip consists of 4 banks with 32 bits wide data. The "B2" indicates it supports a double data rate, allowing data to be transferred on both the rising and falling edges of the clock signal, effectively doubling the data rate. The “P-7” specifies the package type and speed grade, with "7" indicating a specific timing and performance characteristic. The "G" at the end denotes that it is RoHS compliant, meaning it is free from hazardous substances.
This chip is commonly used in various applications, including consumer electronics, networking devices, and embedded systems, providing reliable performance and efficiency in memory-intensive tasks.
Features
1. Type: DDR3 SDRAM (Double Data Rate Synchronous Dynamic Random Access Memory).
2. Density: 4 Gigabits (Gb), organized as 512 Megabytes (MB) x 32 bits.
3. Speed: Operates at a speed grade of 7, which typically indicates a maximum clock frequency of 1066 MT/s (mega-transfers per second).
4. Voltage: Operates at a supply voltage of 1.5V, with a low power option at 1.35V.
5. Package: Available in a 78-ball FBGA (Fine Ball Grid Array) package, suitable for compact designs.
6. Data Rate: Supports burst lengths of 4 and 8, enhancing data throughput.
7. Features: Offers features like self-refresh, refresh with an extended mode, and a command/address multiplexing scheme for efficient performance.
This chip is commonly used in a variety of applications, including computers, servers, and embedded systems.
Package
Pinout
### Pin Functions:
1. Data Pins (DQ0-DQ31): 32 data inputs/outputs for reading from and writing to the memory.
2. Address Pins (A0-A11): 12 address inputs for selecting the row and column.
3. Control Pins:
- CS (Chip Select): Activates the chip.
- RAS (Row Address Strobe): Signals a row access.
- CAS (Column Address Strobe): Signals a column access.
- WE (Write Enable): Indicates a write operation.
4. Clock Pins: Synchronizes operations.
5. Power and Ground Pins: VDD (Power) and VSS (Ground).
6. Baud Rate (BA0, BA1): Bank address inputs for selecting which bank to access.
This memory chip operates at a speed of 7 ns (nanoseconds) and is commonly used in various electronic applications requiring memory storage.
Manufacturer
Application
Equivalent
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Zahlungen
Payment Methods
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