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MX25L12855FXDI-10G
IC FLASH 128MBIT SPI 24CSPBGA
- Hersteller
- Fr. Teil #MX25L12855FXDI-10G
- Paket 24-TBGA,CSPBGA
- Datenblatt
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Spezifikationen
| Package | Tray |
| Series | MXSMIO™ |
| ProductStatus | Active |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NOR |
| MemorySize | 128Mb (16M x 8) |
| MemoryInterface | SPI |
| ClockFrequency | 104 MHz |
| WriteCycleTime-WordPage | 30µs, 3ms |
| Voltage-Supply | 2.7V ~ 3.6V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 24-TBGA, CSPBGA |
Übersicht
Description
Key features include fast read speeds (up to 104 MHz), a variety of programming and erasure options, and a robust erase architecture that supports sector and block erasure. It also offers features like dual and quad I/O modes for improved performance. The MX25L12855FXDI-10G is commonly used in consumer electronics, automotive applications, and industrial devices requiring reliable non-volatile storage.
Its compact 8-pin SOIC package ensures minimal board space usage, while its endurance and data retention specs make it well-suited for applications needing longevity and reliability.
Features
1. Interface: It supports a Quad SPI interface, enabling high-speed data transfer rates of up to 133 MB/s.
2. Memory Architecture: Utilizes a 3.0V power supply with a uniform 4KB sector architecture, facilitating flexible data storage and management.
3. Erase and Write: Supports sector, block, and chip erase operations, with a program/erase cycle endurance of up to 100,000 cycles.
4. Data Retention: Provides a data retention period of up to 20 years under standard conditions.
5. Package Options: Available in a 16-pin SOIC (Standard Outline IC) package, as well as various BGA and WSON options for space-constrained applications.
6. Security Features: Includes features like hardware and software write protection, ensuring data integrity and security.
7. Applications: Commonly used in consumer electronics, automotive, and industrial applications for code and data storage.
This combination of features makes the MX25L12855FXDI-10G suitable for a wide range of embedded applications.
Package
Pinout
1. VCC (Power Supply): Provides power to the chip.
2. GND (Ground): Common ground reference.
3. SCK (Serial Clock): Clock input for SPI communication.
4. SI (Serial Input): Data input pin for SPI.
5. SO (Serial Output): Data output pin for SPI.
6. CS# (Chip Select): Active low chip select for SPI operation.
7. Additional pins include:
- WP# (Write Protect): Active low write protection.
- RESET# (Reset): Active low reset pin, used to reset the chip.
The MX25L12855FXDI-10G supports various modes of operation, including standard SPI and dual/quad I/O modes for higher data transfer rates.
Manufacturer
Application
Equivalent
1. Winbond W25Q128JV
2. Micron MT25QL128ABA
3. Spansion S25FL128S
These alternatives offer similar specifications, including 128Mb capacity and SPI interface, but may differ in specific features and performance. Always check datasheets for compatibility.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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