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NT5AD512M8E3-JRI
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- Fr. Teil #NT5AD512M8E3-JRI
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Spezifikationen
| EU RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.32.00.36 |
| Automotive | Unknown |
| PPAP | Unknown |
| Chip Density (bit) | 4G |
| Number of Bits/Word (bit) | 8 |
| Minimum Operating Supply Voltage (V) | 1.14 |
| Typical Operating Supply Voltage (V) | 1.2 |
| Maximum Operating Supply Voltage (V) | 1.26 |
| Operating Current (mA) | 206 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 95 |
| Mounting | Surface Mount |
| Package Height | 1(Max) |
| Package Width | 7.5 |
| Package Length | 10.5 |
| PCB changed | 78 |
| Supplier Package | TFBGA |
| Pin Count | 78 |
| DRAM Type | DDR4 SDRAM |
| Organization | 512Mx8 |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 128M |
| Data Bus Width (bit) | 8 |
| Maximum Clock Rate (MHz) | 3200 |
| Maximum Access Time (ns) | 0.16 |
| Address Bus Width (bit) | 17 |
| Number of I/O Lines (bit) | 8 |
| Supplier Temperature Grade | Industrial |
Übersicht
Description
Key features include its compatibility with PC3-12800 standards, enabling faster data transfer rates, and its low power consumption, which is essential for battery-operated devices. The module’s design adheres to the SO-DIMM (Small Outline Dual In-line Memory Module) form factor, making it suitable for laptops and compact systems. It also supports features like ECC (Error-Correcting Code) for improved data integrity.
Overall, the NT5AD512M8E3-JRI is an effective solution for applications requiring reliable and efficient memory performance.
Features
1. Type: DDR3 SDRAM
2. Capacity: 512MB
3. Speed: Typically operates at speeds up to 1066 MT/s (megatransfers per second).
4. Organization: Organized as 64 bits x 8 bits.
5. Pin Count: 96-ball FBGA (Fine-pitch Ball Grid Array) package.
6. Voltage: Operates at a low voltage of 1.5V, which helps reduce power consumption.
7. Data Rate: Supports high data transfer rates suitable for various applications.
8. Features: Includes features like burst length of 8 and support for command/address multiplexing.
9. Thermal Characteristics: Designed for efficient thermal performance.
10. Applications: Suitable for use in mobile devices, embedded systems, and other applications requiring compact memory solutions.
This module is ideal for systems that require reliable, efficient, and compact memory solutions.
Package
Pinout
Key functions of the NT5AD512M8E3-JRI include:
1. Data Storage: It provides temporary storage for data being processed by the system.
2. High-Speed Performance: Supports high-speed data transfer rates typical of DDR3 memory.
3. Low Power Consumption: Designed to operate efficiently with lower power requirements compared to earlier memory technologies.
This chip typically operates at a voltage of 1.5V and supports various memory configurations, enhancing system performance in computing environments.
Manufacturer
Application
Equivalent
1. Hynix H5TQ4G83AFR
2. Micron MT41K256M8HA-125
3. Samsung K4B4G0846B-HCK0
Ensure compatibility with your specific application and device requirements.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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