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NT5CC128M16JR-EKH
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- Fr. Teil #NT5CC128M16JR-EKH
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- Datenblatt NT5CC128M16JR-EKH DataSheet
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Spezifikationen
| EU RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.32.00.36 |
| Automotive | Yes |
| PPAP | Yes |
| Mounting | Surface Mount |
| Package Height | 1(Max) |
| Package Width | 7.5 |
| Package Length | 13 |
| PCB changed | 96 |
| Standard Package Name | BGA |
| Supplier Package | TFBGA |
| Pin Count | 96 |
Übersicht
Description
The chip typically operates at voltages around 1.5V and supports data rates up to 1600 MT/s (million transfers per second), making it suitable for high-performance applications. The packaging usually comes in a standard TSOP (Thin Small Outline Package) format, facilitating easy integration on circuit boards.
With its combination of capacity, speed, and energy efficiency, the NT5CC128M16JR-EKH is ideal for applications in consumer electronics, industrial equipment, and telecommunications, contributing to enhanced system performance and reliability.
Features
- Type: DDR3 Synchronous Dynamic Random-Access Memory (SDRAM).
- Capacity: 2 Gigabits (256 Megabytes per chip).
- Configuration: Organized as 128 Meg x 16.
- Data Rate: Supports data rates up to 1600 MT/s (megatransfers per second).
- Voltage: Operates at a standard voltage of 1.5V.
- Package Type: Available in a small 78-ball TFBGA (Thin Fine-pitch Ball Grid Array) package.
- Performance: Designed for high performance in computing and networking applications.
- Applications: Ideal for laptops, desktop computers, and embedded systems requiring efficient memory solutions.
This chip provides reliable and efficient memory performance suitable for various electronic devices.
Package
Pinout
Key functions:
- It operates at a voltage of 1.5V and supports data rates of up to 1600 MT/s (megatransfers per second).
- The chip is designed for use in various applications, including computers, servers, and embedded systems, providing efficient data storage and retrieval.
- It features a 128M x 16-bit architecture, allowing for high-density memory solutions.
- The device supports various memory operations, including read, write, refresh, and burst access.
This chip is part of a broader family of DDR3 memory solutions, widely used for its improved performance compared to earlier generations.
Manufacturer
Application
1. Consumer Electronics - Televisions, gaming consoles, and set-top boxes.
2. Computers - Laptops and desktops for improved performance.
3. Networking Equipment - Routers and switches for data handling.
4. Embedded Systems - Industrial control systems and automotive applications.
5. Mobile Devices - Smartphones and tablets for efficient memory storage.
Its high-speed data transfer capabilities make it suitable for applications requiring rapid access to memory.
Equivalent
1. Hynix H5TQ1G83AFR
2. Micron MT41J128M16HA-125
3. Samsung K4B4G1646D
4. Kingston KVR16S11/1G
Always check specifications for compatibility, including speed, voltage, and package type.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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