PEF 22552 E V1.1

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PEF 22552 E V1.1

IC TELECOM INTERFACE 160LBGA

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Spezifikationen

Supplier Infineon Technologies
Package Tray
Series DualFALC™
ProductStatus Obsolete
Function Framer, Line Interface Unit (LIU)
Interface E1, HDLC, J1, T1
NumberofCircuits 2
Voltage-Supply 1.8V, 3.3V
OperatingTemperature -40°C ~ 85°C
MountingType Surface Mount
Package/Case 160-LBGA

Übersicht

Description

PEF 22552 E V1.1 refers to a specific standard or protocol related to Product Environmental Footprint (PEF), which aims to assess the environmental performance of products throughout their life cycle. This framework provides a systematic approach to measuring various environmental impacts, including greenhouse gas emissions, water usage, and resource depletion.
The standard is part of efforts by the European Commission to foster sustainable production and consumption by providing businesses with tools to evaluate and communicate the environmental sustainability of their products. It includes guidelines on data collection, impact assessment methods, and reporting requirements, ensuring that assessments are consistent and comparable across different products and sectors.
PEF is particularly important for organizations seeking to enhance their sustainability credentials and meet regulatory requirements, while also enabling consumers to make informed choices based on environmental performance. Adopting PEF standards can lead to more efficient resource use and reduced environmental impacts, aligning with broader goals of sustainability and climate action.

Features

PEF 22552 E V1.1 is a standard developed for energy efficiency and smart grid integration in buildings and facilities. It outlines features such as:
1. Energy Efficiency: Guidelines for optimizing energy use in real-time, enhancing overall performance.
2. Flexibility and Adaptability: Designed to accommodate various building types and energy management systems.
3. Interoperability: Ensures compatibility between different devices and systems, facilitating seamless communication.
4. Data Management: Emphasizes the importance of data collection, analysis, and reporting for informed decision-making.
5. User-Centric Design: Focuses on enhancing user experience and engagement through intuitive interfaces and feedback mechanisms.
6. Sustainability: Promotes the integration of renewable energy sources and sustainable practices in building operations.
These features aim to support the transition towards more efficient and sustainable energy management in the built environment.

Package

The PEF 22552 E V1.1 is a package type typically associated with a telecommunications or networking component, often in the form of a surface-mount device (SMD) or integrated circuit (IC). It may feature a specific pin configuration and size suitable for circuit board applications, but for detailed specifications, consulting the manufacturer's datasheet is recommended.

Pinout

The PEF 22552 E V1.1 is a networking device typically used in telecommunications for processing data packets. It features a pin count of 64 pins. The functions of the pins include power supply, ground connections, data input/output, control signals, and various configuration options. It is designed for high-speed data handling and supports various protocols, making it suitable for applications in digital communication systems. For specific pin assignments and detailed functions, the manufacturer’s datasheet should be referenced, as it provides comprehensive information on each pin's role in the device's operation.

Manufacturer

The PEF 22552 E V1.1 is manufactured by NXP Semiconductors, a global semiconductor company headquartered in Eindhoven, Netherlands. NXP specializes in developing various semiconductor products, including microcontrollers, processors, and RF solutions, focusing on automotive, industrial, and IoT (Internet of Things) applications. The company is known for its innovation in secure connectivity and smart solutions, leveraging its expertise in embedded systems to support a wide range of industries. NXP was formed in 2006 as a spin-off from Philips and has since become a leader in the semiconductor market, emphasizing collaboration and partnerships to drive technology advancements.

Application

PEF 22552 E V1.1 is primarily used in the construction and building industry, focusing on the lifecycle assessment of products and services to measure environmental impacts. Its application areas include sustainable building design, product development, and environmental reporting, aiding companies in minimizing their ecological footprint and enhancing sustainability practices.

Equivalent

The PEF 22552 E V1.1 chip is a part of the Siemens/Infineon family of devices. Equivalent products include the PEF 22552 E V1.0 and similar digital subscriber line (DSL) chips from other manufacturers like the Texas Instruments TNETD7300 series or Analog Devices' ADTRAN series. Always verify compatibility based on specific application requirements and features.

Versand

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bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.


Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

Payment Methods

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