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RD3P130SPFRATL
MOSFET P-CH 100V 13A TO252
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Spezifikationen
| Part Status | Active |
| FET Type | P-Channel |
| Technology | MOSFET (Metal Oxide) |
| Drain to Source Voltage (Vdss) | 100 V |
| Current - Continuous Drain (Id) @ 25°C | 13A (Ta) |
| Drive Voltage (Max Rds On, Min Rds On) | 4V, 10V |
| Rds On (Max) @ Id, Vgs | 200mOhm @ 6.5A, 10V |
| Vgs(th) (Max) @ Id | 2.5V @ 1mA |
| Gate Charge (Qg) (Max) @ Vgs | 40 nC @ 10 V |
| Vgs (Max) | ±20V |
| Input Capacitance (Ciss) (Max) @ Vds | 2400 pF @ 25 V |
| Power Dissipation (Max) | 20W (Tc) |
| Operating Temperature | 150°C (TJ) |
| Grade | Automotive |
| Qualification | AEC-Q101 |
| Mounting Type | Surface Mount |
| Supplier Device Package | TO-252 |
| Package / Case | TO-252-3, DPAK (2 Leads + Tab), SC-63 |
| Base Product Number | RD3P130 |
Übersicht
Description
To gain a better understanding, it would be beneficial to refer to the product's datasheet, manufacturer’s specifications, or relevant technical documentation. This information would typically include details about its applications, performance characteristics, installation guidelines, and operational parameters. If you have a specific context or industry in mind, please provide that for a more tailored response.
Features
1. Architecture: 32-bit RXv2 core, offering enhanced performance and efficiency.
2. Clock Speed: Operates at up to 130 MHz, facilitating quick processing capabilities.
3. Flash Memory: Up to 128 KB of onboard flash memory, providing ample space for applications.
4. RAM: 16 KB of SRAM for data storage during operation.
5. Peripheral Interfaces: Supports various communication interfaces, including UART, SPI, and I2C.
6. Analog Features: Integrated ADC (Analog-to-Digital Converter) for sensor interfacing.
7. Low Power Consumption: Designed for energy-efficient applications, ideal for battery-operated devices.
8. Safety Features: Incorporates hardware safety mechanisms suitable for automotive and industrial applications.
9. Development Support: Compatible with a range of development tools and environments for ease of programming and debugging.
Overall, the RD3P130SPFRATL is optimized for embedded applications requiring reliability and performance.
Package
Pinout
1. Gate (G): Controls the on/off state of the MOSFET.
2. Drain (D): Connects to the load; the current flows out from this terminal.
3. Source (S): Connects to the ground or power source; current flows into this terminal.
Additional pins may include:
4. Substrate: Often internally connected to the source to prevent latch-up.
5. Thermal Pad: Used for heat dissipation, enhancing reliability.
For specific applications and electrical characteristics, it's essential to consult the manufacturer's datasheet.
Manufacturer
Application
Equivalent
Versand
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bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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