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S25FL512SAGMFBG10
IC FLASH 512MBIT SPI/QUAD 16SOIC
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Spezifikationen
| Series | FL-S |
| Part Status | Active |
| DigiKey Programmable | Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 512Mbit |
| Memory Organization | 64M x 8 |
| Memory Interface | SPI - Quad I/O |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 16-SOIC (0.295", 7.50mm Width) |
| Supplier Device Package | 16-SOIC |
| Base Product Number | S25FL512 |
| Clock Frequency | 133 MHz |
| Grade | Automotive |
| Qualification | AEC-Q100 |
Übersicht
Description
Key features include support for the Serial Peripheral Interface (SPI) protocol, which allows for fast data transfer rates, and a variety of read and write modes. The device is organized into sectors, enabling efficient memory management and partial updates.
With a robust architecture, it offers features like sector erase, program, and page write capabilities, along with advanced security options. It is well-suited for applications that require non-volatile storage, such as firmware storage, configuration data, and system boot processes.
The S25FL512SAGMFBG10 is packaged in a compact 8-pin SOIC form factor, making it suitable for space-constrained designs. Its reliability and performance make it a popular choice among developers looking for efficient and durable memory solutions.
Features
1. Data Interface: Supports a Serial Peripheral Interface (SPI) with dual and quad I/O modes for high-speed data transfer.
2. Speed: Offers read speeds up to 133 MHz, enhancing performance for data-intensive applications.
3. Density: 512 Mb capacity suitable for a variety of applications such as consumer electronics, automotive, and industrial devices.
4. Memory Architecture: Contains multiple sectors (64 x 1 MB) and blocks (1024 x 512 KB), allowing for flexible data management and efficient erasing.
5. Endurance & Reliability: Supports up to 100,000 program/erase cycles per sector and has a data retention of 20 years.
6. Power Consumption: Low active and standby current enhances energy efficiency in battery-operated devices.
7. Package: Available in various packages (e.g., SOIC, WSON) for ease of integration.
This device is suitable for applications requiring reliable, high-speed storage and easy interfacing.
Package
Pinout
1. VCC (Power Supply): Provides power to the chip.
2. GND (Ground): Common ground connection.
3. SCK (Serial Clock): Clock input for synchronous operation.
4. CS# (Chip Select): Active low signal to enable the device.
5. SI (Serial Input): Data input pin for commands and data.
6. SO (Serial Output): Data output pin for read operations.
7. WP# (Write Protect): Active low pin to enable write protection.
8. HOLD# (Hold): Active low pin to pause serial communication without deselecting the chip.
The device supports various features like quad SPI, fast read, and sector erase, making it suitable for a variety of applications in embedded systems.
Manufacturer
Application
Equivalent
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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