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S34ML01G100TFI000
IC FLASH 1GBIT PARALLEL 48TSOP I
- Hersteller
- Fr. Teil #S34ML01G100TFI000
- Paket 48-TSOP
- Datenblatt
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Spezifikationen
| Package | Tray,Tray |
| Series | ML-1 |
| ProductStatus | Active |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NAND |
| MemorySize | 1Gb (128M x 8) |
| MemoryInterface | Parallel |
| WriteCycleTime-WordPage | 25ns |
| Voltage-Supply | 2.7V ~ 3.6V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 48-TFSOP (0.724, 18.40mm Width) |
Übersicht
Description
Key features include low power consumption, making it suitable for battery-operated devices, and a robust error correction mechanism to maintain data integrity. The chip is often used for firmware storage, system booting, and data logging, benefiting from its fast read/write speeds. Its compact size and versatility make it ideal for space-constrained applications.
Overall, the S34ML01G100TFI000 represents a reliable choice for manufacturers seeking high-performance memory solutions in a competitive market.
Features
1. Memory Type: NAND Flash, SLC (Single-Level Cell) technology for high reliability and performance.
2. Interface: Supports a standard ONFI (Open NAND Flash Interface) interface for easy integration and compatibility with various controllers.
3. Density: 1 Gbit capacity, suitable for applications requiring moderate storage solutions.
4. Voltage Range: Operates typically at 3.3V, with low power consumption for energy-efficient applications.
5. Page Size: Typically around 2KB or 4KB, allowing efficient data management.
6. Block Size: Usually organized into blocks of 128KB or more, enabling efficient data write and erase cycles.
7. Endurance: Offers high endurance levels with many program/erase cycles, ensuring durability for intensive applications.
8. Applications: Commonly used in consumer electronics, automotive, industrial applications, and embedded systems.
This device is designed for applications that require reliable data storage with fast access times.
Package
Pinout
1. DQs (Data Pins): 8 data pins (DQ0-DQ7) for data input/output.
2. CMD (Command): A pin for command inputs.
3. CLK (Clock): Clock input for synchronous operations.
4. CS (Chip Select): Used to select the chip for communication.
5. WP (Write Protect): Pin for write protection control.
6. RB (Ready/Busy): Indicates the status of the chip (ready or busy).
7. VCC and VSS: Power supply and ground pins.
This NAND flash memory supports various interfaces, including ONFI (Open NAND Flash Interface) and has a range of features suitable for embedded applications, such as low power consumption and high-speed performance.
Manufacturer
Application
Equivalent
1. Micron MT29F1G01ABAEAWP
2. Samsung K9GAG08U0M
3. Toshiba TH58TEG7D2LBAIL
4. Hynix H26M52103GTR
Ensure to check specific features like interface type, voltage, and package dimensions for compatibility.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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