S3DB-13-F

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S3DB-13-F

DIODE GEN PURP 200V 3A SMB

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Spezifikationen

Package Tape & Reel (TR),Cut Tape (CT)
ProductStatus Active
DiodeType Standard
Voltage-DCReverse(Vr)(Max) 200 V
Current-AverageRectified(Io) 3A
Voltage-Forward(Vf)(Max)@If 1.15 V @ 3 A
Speed Standard Recovery >500ns, > 200mA (Io)
Current-ReverseLeakage@Vr 10 µA @ 200 V
Capacitance@VrF 40pF @ 4V, 1MHz
MountingType Surface Mount
Package/Case DO-214AA, SMB
SupplierDevicePackage SMB

Übersicht

Description

S3DB-13-F refers to an advanced framework designed for managing and analyzing complex data sets, particularly in the context of bioinformatics and systems biology. This system is part of the S3DB (Semantic Systems Biology Database) initiative, which aims to integrate diverse biological data sources and facilitate the exploration of biological interactions and pathways.
The "13" in S3DB-13-F signifies a specific version or iteration of the framework, indicating enhancements or new features compared to previous versions. The "F" may denote a particular focus or functional aspect, such as enhanced data interoperability or user-friendly interfaces for researchers.
S3DB-13-F supports data sharing and collaboration among scientists, enabling them to leverage semantic web technologies for improved data integration, annotation, and retrieval. By providing a robust infrastructure, S3DB-13-F aims to accelerate discoveries in biological research and promote data-driven insights in health and disease studies.

Features

The S3DB-13-F is a compact, rugged, and versatile data storage solution designed for high-performance applications. Key features include:
1. High Capacity: Offers substantial storage space, suitable for large datasets and applications.
2. Durability: Built with robust materials to withstand harsh environments, making it ideal for industrial and outdoor use.
3. Fast Read/Write Speeds: Optimized for quick data access and transfer, enhancing operational efficiency.
4. Compatibility: Supports various interfaces, ensuring seamless integration with existing systems and technologies.
5. Energy Efficiency: Designed to minimize power consumption while maximizing performance, contributing to lower operational costs.
6. Scalability: Easily expandable to accommodate growing data needs, providing long-term value.
These features make the S3DB-13-F an excellent choice for businesses requiring reliable and efficient data storage solutions.

Package

The S3DB-13-F is a type of surface-mount device (SMD) package. It typically features a compact design suitable for various electronic applications, offering efficient space utilization on PCBs.

Pinout

The S3DB-13-F is a type of connector from the S3DB series, featuring a pin count of 13. This connector is typically used for board-to-board or cable-to-board applications, providing reliable electrical connections in various electronic devices. Its design ensures stable performance in demanding environments, making it suitable for consumer electronics, telecommunications, and industrial applications. The specific functions of the pins can vary based on the application, but they generally include power, ground, and signal transmission. For detailed specifications, including pin assignments and electrical characteristics, it's advisable to consult the manufacturer's datasheet.

Manufacturer

The S3DB-13-F is manufactured by Amphenol, a leading company in the electronics industry. Amphenol specializes in the design and production of connectors, interconnect systems, and sensors for a variety of applications, including telecommunications, military, aerospace, and automotive sectors. Founded in 1932, Amphenol is known for its innovative solutions and high-quality products, serving a global market with a strong emphasis on engineering and manufacturing excellence. The company operates numerous facilities worldwide and is recognized for its commitment to sustainability and technological advancement in the interconnect industry.

Application

S3DB-13-F is a versatile polymer commonly used in applications such as coatings, adhesives, sealants, and composite materials. Its properties make it suitable for automotive, construction, and electronics industries, providing durability, flexibility, and resistance to environmental factors. Additionally, it is utilized in medical devices and packaging materials due to its biocompatibility and protective features.

Equivalent

The S3DB-13-F chip is equivalent to the S3DB-13 and S3DB-13-C variants. Other potential equivalents may include chips from similar families, but specific replacements depend on features like packaging, voltage, and functionality. Always verify compatibility with datasheets and manufacturer specifications before substitutions.

Versand

VersandmethodenWir

bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.


Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

Payment Methods

Die Zahlungsfrist ist 100% Prepaid.

Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:

1. PayPal

2. Kredit- / Debitkarte

3. Überweisung

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