SI4477DY-T1-GE3

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SI4477DY-T1-GE3

MOSFET P-CH 20V 26.6A 8SO

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Spezifikationen

Supplier Vishay Siliconix
Package Tape & Reel (TR),Cut Tape (CT)
Series TrenchFET®
ProductStatus Active
FETType P-Channel
Technology MOSFET (Metal Oxide)
DraintoSourceVoltage(Vdss) 20 V
Current-ContinuousDrain(Id)@25°C 26.6A (Tc)
DriveVoltage(MaxRdsOnMinRdsOn) 2.5V, 4.5V
RdsOn(Max)@IdVgs 6.2mOhm @ 18A, 4.5V
Vgs(th)(Max)@Id 1.5V @ 250µA
GateCharge(Qg)(Max)@Vgs 190 nC @ 10 V
Vgs(Max) ±12V
InputCapacitance(Ciss)(Max)@Vds 4600 pF @ 10 V
PowerDissipation(Max) 3W (Ta), 6.6W (Tc)
OperatingTemperature -55°C ~ 150°C (TJ)
MountingType Surface Mount
SupplierDevicePackage 8-SOIC

Übersicht

Description

SI4477DY-T1-GE3 is a wireless RF transceiver IC (part of the SI447x family) intended for ISM-band wireless links in embedded systems. It typically combines an RF front end (PA/LNA) with a digital modem and is controlled over a serial interface (SPI). The device supports configurable frequency bands and data rates, multiple modulation schemes (commonly FSK/GFSK and OOK/ASK), adjustable transmit power, and receiver sensitivity, with low-power sleep modes for battery-powered applications. Packaging variants (the “-T1-GE3” suffix) indicate specific tape-and-reel/package options and pinout details.
Common applications include wireless sensors, meters, remote controls, and IoT edge devices. Exact features, frequency coverage, power budgets, and electrical characteristics vary by revision, so always consult the official datasheet and reference designs for SI4477DY-T1-GE3. A typical quick-start path is to use the vendor’s reference design, configure registers over SPI, verify with an RF test setup, and ensure proper antenna matching and PCB layout per guidelines.

Features

Here are typical features of the SI4477DY-T1-GE3 transceiver (check the datasheet for exact limits per variant):
- Highly integrated sub‑GHz RF transceiver with on‑chip PLL/VCO and RF front‑end.
- Programmable frequency plan suitable for ISM bands (region variants such as 868/915 MHz).
- Modulations: GFSK, FSK, MSK, and OOK/ASK supported.
- Data rates in hundreds of kbps (programmable and suitable for low‑rate wireless links).
- Adjustable TX power over a wide range; fast TX/RX turn‑around for duty‑cycle efficiency.
- Low‑power operation with multiple sleep/standby modes; wake‑up from RF activity.
- Digital packet engine: CRC, address filtering, FIFO for TX/RX, optional ACKs.
- RF performance: high RX sensitivity and selectivity with RSSI measurements.
- Interfaces: SPI control, GPIOs, IRQs; operates from 1.8–3.6 V.
- RF front‑end flexibility: integrated LNA/Mixer with support for external PA/LNA and matching networks.
- Compact packaging (QFN) with RoHS/compliant options.
Note: exact specs (bands, data rates, TX power, current) depend on the specific variant and region. Refer to the official datasheet for precise figures.

Package

The SI4477DY-T1-GE3 is supplied in an 8-pin SOIC (SO-8 / SOP-8) surface-mount package (dual MOSFET in SO-8).

Pinout

SI4477DY-T1-GE3 is an 8-pin dual N‑channel enhancement MOSFET. Functionally it contains two N‑MOSFETs: each FET has Gate, Drain and Source pins (G1, D1, S1 for FET1; G2, D2, S2 for FET2). The remaining package pins are package/thermal or NC connections per the manufacturer’s package drawing.

Manufacturer

Manufacturer: Vishay Intertechnology (branded Vishay Siliconix).
What kind of company: Vishay is a multinational electronics manufacturer that designs and produces discrete semiconductors (MOSFETs, diodes, transistors) and passive components (resistors, capacitors, inductors), headquartered in Malvern, Pennsylvania.

Application

Applications: RF front-end/Power amplifier for ISM-band wireless systems (primarily 2.4 GHz). Suitable for IoT sensors, Zigbee/BLE/WLAN modules, wireless routers and access points, industrial and automotive wireless subsystems, and handheld wireless devices.

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