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SI4966DY-T1-E3
MOSFET 2N-CH 20V 8SOIC
- Hersteller
- Fr. Teil #SI4966DY-T1-E3
- Paket SOIC-8
- Datenblatt SI4966DY-T1-E3 DataSheet
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Spezifikationen
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Series | TrenchFET® |
| ProductStatus | Obsolete |
| FETType | 2 N-Channel (Dual) |
| FETFeature | Logic Level Gate |
| DraintoSourceVoltage(Vdss) | 20V |
| RdsOn(Max)@IdVgs | 25mOhm @ 7.1A, 4.5V |
| Vgs(th)(Max)@Id | 1.5V @ 250µA |
| GateCharge(Qg)(Max)@Vgs | 50nC @ 4.5V |
| Power-Max | 2W |
| OperatingTemperature | -55°C ~ 150°C (TJ) |
| MountingType | Surface Mount |
| Package/Case | 8-SOIC (0.154, 3.90mm Width) |
Übersicht
Description
Key specifications include a maximum drain-source voltage (VDS) rating of 30V and a continuous drain current (ID) rating that supports robust performance in various applications. Its compact Surface Mount Device (SMD) package enhances design flexibility and ease of integration into circuit boards.
Additionally, the SI4966DY-T1-E3 is designed with a fast switching speed, which helps reduce transition losses, making it ideal for high-frequency applications. This MOSFET is typically used in consumer electronics, automotive, and industrial systems where reliability and efficiency are paramount.
Features
1. Dual N-Channel Configuration: Provides two MOSFETs in a single package for space-saving designs.
2. Low On-Resistance (RDS(on)): Ensures minimal power loss and improved efficiency, with typical values around 7.5 mΩ at VGS = 10V.
3. High-Speed Switching: Allows for rapid switching applications, making it suitable for DC-DC converters and power supply designs.
4. Wide Voltage Range: Supports a maximum drain-source voltage (VDS) of 30V, accommodating various voltage applications.
5. Low Gate Charge (QG): Reduces drive losses, enhancing overall circuit performance.
6. Thermal Performance: Packaged in a compact SO-8 footprint, facilitating better thermal dissipation.
7. RoHS Compliant: Ensures environmental safety and compliance with industry regulations.
Overall, the SI4966DY-T1-E3 is ideal for applications in power management, automotive, and other high-efficiency systems.
Package
Pinout
1. Gate 1 (G1) - Gate terminal for the first N-channel MOSFET.
2. Source 1 (S1) - Source terminal for the first N-channel MOSFET.
3. Drain 1 (D1) - Drain terminal for the first N-channel MOSFET.
4. Gate 2 (G2) - Gate terminal for the second N-channel MOSFET.
5. Source 2 (S2) - Source terminal for the second N-channel MOSFET.
6. Drain 2 (D2) - Drain terminal for the second N-channel MOSFET.
7. Common Source (CS) - Common source connection for both MOSFETs.
8. Thermal Pad (TP) - Used for heat dissipation; requires PCB thermal management.
The device is commonly used in applications such as DC-DC converters, motor drives, and other power conversion systems.
Manufacturer
Application
Equivalent
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Zahlungen
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