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SISS23DN-T1-GE3
MOSFET P-CH 20V 50A PPAK 1212-8S
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- Fr. Teil #SISS23DN-T1-GE3
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- Datenblatt SISS23DN-T1-GE3 DataSheet
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Spezifikationen
| Series | TrenchFET® |
| Part Status | Active |
| FET Type | P-Channel |
| Technology | MOSFET (Metal Oxide) |
| Drain to Source Voltage (Vdss) | 20 V |
| Current - Continuous Drain (Id) @ 25°C | 50A (Tc) |
| Drive Voltage (Max Rds On, Min Rds On) | 1.8V, 4.5V |
| Rds On (Max) @ Id, Vgs | 4.5mOhm @ 20A, 4.5V |
| Vgs(th) (Max) @ Id | 900mV @ 250µA |
| Gate Charge (Qg) (Max) @ Vgs | 300 nC @ 10 V |
| Vgs (Max) | ±8V |
| Input Capacitance (Ciss) (Max) @ Vds | 8840 pF @ 15 V |
| Power Dissipation (Max) | 4.8W (Ta), 57W (Tc) |
| Operating Temperature | -50°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
| Supplier Device Package | PowerPAK® 1212-8S |
| Package / Case | PowerPAK® 1212-8S |
| Base Product Number | SISS23 |
Übersicht
Description
This IC is widely utilized in consumer electronics, industrial devices, and automotive applications, where efficiency and reliability are crucial. Users benefit from its compact size and high integration, which contribute to reduced circuit board space and increased performance. For detailed specifications, performance characteristics, and application notes, consulting the manufacturer's datasheet is recommended.
Features
1. Voltage Rating: Typically rated at 30V, making it suitable for low to medium voltage applications.
2. Current Rating: Supports a continuous drain current of up to 60A, providing robust performance for demanding applications.
3. Low RDS(on): This MOSFET has a low on-resistance, ensuring minimal power loss and heat generation during operation, enhancing efficiency.
4. Fast Switching Speed: Offers high switching frequencies, making it ideal for applications like DC-DC converters and motor drives.
5. Thermal Performance: Designed for efficient thermal dissipation, allowing for reliable operation under high-temperature conditions.
6. Package Type: Available in a compact package, facilitating easier integration into various designs while saving board space.
These features make the SISS23DN-T1-GE3 suitable for a range of applications, including power management, automotive systems, and consumer electronics.
Package
Pinout
The pin configuration typically includes:
1. Gate 1 (G1) - Controls the switching of the first MOSFET.
2. Drain 1 (D1) - The output where current flows from the first MOSFET.
3. Source 1 (S1) - The input side of the first MOSFET.
4. Gate 2 (G2) - Controls the switching of the second MOSFET.
5. Drain 2 (D2) - The output where current flows from the second MOSFET.
6. Source 2 (S2) - The input side of the second MOSFET.
7. Drain 1 (D1) - Common drain for the first MOSFET.
8. Source 2 (S2) - Common source for the second MOSFET.
This device is commonly utilized in power management and switching applications due to its low on-resistance and fast switching capabilities.
Manufacturer
Application
Equivalent
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Zahlungen
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