Bilder sind nur zur Referenz
TC58BVG0S3HTAI0
IC FLASH 1GBIT PARALLEL 48TSOP I
- Hersteller
- Fr. Teil #TC58BVG0S3HTAI0
- Paket TSOP48
- Datenblatt
- Auf Lager6482
100% Original und Neu
24 Stunden bereit zum Versand
365 Tage Garantie
RFQ & Erhalten Sie mehr Rabatte
Spezifikationen
| Package | Tray |
| Series | Benand™ |
| ProductStatus | Active |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NAND (SLC) |
| MemorySize | 1Gb (128M x 8) |
| MemoryInterface | Parallel |
| WriteCycleTime-WordPage | 25ns |
| AccessTime | 25 ns |
| Voltage-Supply | 2.7V ~ 3.6V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 48-TFSOP (0.724, 18.40mm Width) |
Übersicht
Description
Key features include fast read and write speeds, enhanced endurance, and lower power consumption compared to traditional 2D NAND flash. Its architecture enables higher data integrity and reliability, making it suitable for demanding applications. Additionally, the TC58BVG0S3HTAI0 supports advanced features like wear leveling and error correction, which are crucial for maintaining the longevity and performance of flash storage.
Overall, this NAND flash chip is an important component in modern digital devices, enabling faster data access and increased storage capabilities.
Features
1. Capacity: 128 gigabits (16 gigabytes) of storage.
2. Technology: Utilizes 3D NAND technology, which enhances density and performance.
3. Interface: Supports the Serial Peripheral Interface (SPI) for easy integration into various devices.
4. Performance: Offers high read and write speeds, making it suitable for demanding applications.
5. Endurance: Designed for a high number of program/erase cycles, ensuring longevity.
6. Power Efficiency: Operates at lower voltage levels, contributing to reduced power consumption.
7. Applications: Ideal for smartphones, tablets, SSDs, and other electronic devices requiring reliable storage solutions.
This combination of features makes the TC58BVG0S3HTAI0 a versatile choice for modern storage needs.
Package
Pinout
Key pins include:
- VCC: Power supply for the device.
- GND: Ground connection.
- DQ0-DQ7: Data input/output lines for 8-bit data transfer.
- CE#: Chip Enable, used to activate the device.
- RE#: Read Enable, used to initiate read operations.
- WE#: Write Enable, used to initiate write operations.
- R/B: Ready/Busy output, indicating the status of the device.
These features make the TC58BVG0S3HTAI0 suitable for various applications in consumer electronics, computing, and mobile devices, providing high-density storage solutions.
Manufacturer
Application
Equivalent
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
Ähnliche
-
MX25R8035FM1IL0
Macronix
-
MX25V1635FZNQ03
Macronix
-
MX29F400CBTI-70G
Macronix
-
MX25V2033FM1I
Macronix
-
MX25V16066M1I02
Macronix
-
MX30LF2G28AD-TI
Macronix
-
MX25R6435FBDIL0
Macronix
-
MX25L25673GMI-08G
Macronix
-
MX25V1635FM2I
Macronix
-
MX25U3232FZBI02
Macronix
-
MX25L6433FM2I-08G
Macronix
-
MX25U6435FM2I-10G
Macronix