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THGBMJG6C1LBAB7
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- Fr. Teil #THGBMJG6C1LBAB7
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- Datenblatt THGBMJG6C1LBAB7 DataSheet
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Spezifikationen
| EU RoHS | Compliant |
| ECCN (US) | 3A991.b.1.a |
| Part Status | Unconfirmed |
| HTS | 8542.32.00.71 |
| Automotive | Yes |
| PPAP | Unknown |
| Cell Type | NAND |
| Chip Density (bit) | 64G |
| Programmability | Yes |
| Timing Type | Synchronous |
| Interface Type | Serial e-MMC |
| Minimum Operating Supply Voltage (V) | 2.7 |
| Typical Operating Supply Voltage (V) | 3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 105 |
| Mounting | Surface Mount |
| Package Height | 1 |
| Package Width | 11.5 |
| Package Length | 13 |
| PCB changed | 153 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| Pin Count | 153 |
Übersicht
Description
NAND flash memory, like THGBMJG6C1LBAB7, operates on a non-volatile basis, meaning it retains data even when power is turned off. It typically includes multiple memory layers to enhance storage capacity and performance.
The specific part number indicates its capacity, interface, and other technical specifications, making it suitable for designers and engineers looking to implement advanced storage in their products. The chip is part of a broader trend towards increasing storage density and speed in electronic devices, addressing the growing demand for data-intensive applications.
For detailed technical specifications, it’s recommended to refer to the manufacturer's datasheet.
Features
1. Capacity: 16GB of storage space.
2. Interface: Uses a high-speed eMMC 5.1 interface, providing enhanced data transfer rates and reliability.
3. Performance: Offers improved read and write speeds, suitable for mobile devices and consumer electronics.
4. Form Factor: Compact size, allowing for integration into smartphones, tablets, and other portable devices.
5. Durability: Designed for robust performance with wear leveling and error correction features to extend lifespan.
6. Power Efficiency: Consumes low power, which is crucial for battery-operated devices.
Overall, the THGBMJG6C1LBAB7 is ideal for applications requiring efficient, high-capacity storage solutions in compact form factors.
Package
Pinout
It utilizes 3D NAND technology, allowing for higher storage density and improved performance compared to traditional planar NAND. The THGBMJG6C1LBAB7 supports various data transfer protocols, enabling efficient read and write operations. Its features include fast access times, endurance, and reliability, making it suitable for a wide range of applications requiring persistent storage.
Manufacturer
Application
Equivalent
1. Toshiba TC58NVG3S0HBAI4
2. Samsung KLM64G6QEB-B041
3. Micron MTFC64GAKCE
4. Kingston eMMC 64GB (various part numbers)
Always verify compatibility and specifications based on your specific application needs.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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