THGBMJG6C1LBAU7

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THGBMJG6C1LBAU7

IC FLASH 64GBIT EMMC 153FBGA

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  • Fr. Teil #THGBMJG6C1LBAU7
  • Paket FBGA-153
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Spezifikationen

Package Tray
Series e•MMC™
ProductStatus Active
MemoryType Non-Volatile
MemoryFormat FLASH
Technology FLASH - NAND
MemorySize 64Gb (8G x 8)
MemoryInterface eMMC
OperatingTemperature -40°C ~ 105°C (TA)
MountingType Surface Mount
Package/Case 153-WFBGA

Übersicht

Description

THGBMJG6C1LBAU7 is a part number for a specific type of NAND flash memory chip manufactured by Toshiba. This component is typically used in various electronic devices, including smartphones, tablets, and other consumer electronics. NAND flash memory is known for its high storage capacity and fast data access speeds, making it essential for applications requiring quick data retrieval and storage efficiency.
The designation "THGBMJG6C1LBAU7" indicates specific characteristics such as memory type, capacity, and configuration. This chip is often utilized in embedded systems and can support features like wear leveling and error correction to enhance data reliability and longevity. Understanding the specifications and functionalities of such memory components is crucial for engineers and designers working in electronics and computing fields, ensuring optimal performance and compatibility in their applications.

Features

THGBMJG6C1LBAU7 is a NAND flash memory chip produced by Toshiba. It features a 64GB storage capacity and is built using a 3D NAND technology, which increases density and performance while reducing power consumption. This chip supports various interface protocols, typically eMMC (Embedded MultiMediaCard), making it suitable for use in smartphones, tablets, and other portable devices.
Key features include:
- Storage Capacity: 64GB
- Interface: eMMC 5.0 or similar
- Form Factor: BGA (Ball Grid Array) for compact integration
- Performance: Enhanced read/write speeds due to 3D NAND architecture
- Power Efficiency: Lower power consumption compared to traditional 2D NAND
- Reliability: Designed for high endurance and data retention.
Overall, THGBMJG6C1LBAU7 is engineered for efficient data storage in consumer electronics, balancing performance, reliability, and energy efficiency.

Package

The THGBMJG6C1LBAU7 is a NAND flash memory chip packaged in a BGA (Ball Grid Array) format, specifically designed for mobile and embedded applications. It typically features a compact design suitable for integration in various electronic devices.

Pinout

The THGBMJG6C1LBAU7 is a NAND flash memory chip manufactured by Toshiba (now Kioxia). It typically comes in a 48-ball BGA (Ball Grid Array) package, which means it has 48 pins (balls) for connections.
The primary function of this chip is to serve as non-volatile storage, commonly used in consumer electronics such as smartphones, tablets, and SSDs. It utilizes the NAND flash technology to store data persistently without requiring power. The chip supports various operations including reading, writing, and erasing data, and is designed for high-speed performance and endurance, making it suitable for applications that require reliable and fast data access.
For specific details regarding electrical characteristics and operational parameters, consulting the manufacturer's datasheet is recommended.

Manufacturer

The manufacturer of the THGBMJG6C1LBAU7 is Toshiba Memory Corporation, which is now part of Kioxia Corporation. Kioxia is a global leader in flash memory and storage solutions, specializing in NAND flash memory products. The company designs and manufactures advanced memory and storage products used in a wide range of applications, including consumer electronics, data centers, and mobile devices. Kioxia was established as a spin-off from Toshiba Corporation's memory business and continues to innovate in the semiconductor industry, focusing on high-performance, high-capacity storage solutions.

Application

THGBMJG6C1LBAU7 is a NAND flash memory chip commonly used in applications such as smartphones, tablets, digital cameras, and portable media players. It is also utilized in embedded systems, automotive electronics, and for storage in various consumer electronics due to its high speed, reliability, and compact size.

Equivalent

The THGBMJG6C1LBAU7 is a Toshiba NAND flash memory chip (eMMC). Equivalent products include Samsung KLMAG2GE4A, Micron MT29F64G08CBABA, and SK Hynix H26M31001G2. Always check specific datasheets for compatibility and specifications before substituting any components.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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