UF3C170400K3S

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UF3C170400K3S

SICFET N-CH 1700V 7.6A TO247-3

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Spezifikationen

Part Status Active
FET Type N-Channel
Technology SiCFET (Cascode SiCJFET)
Drain to Source Voltage (Vdss) 1700 V
Current - Continuous Drain (Id) @ 25°C 7.6A (Tc)
Drive Voltage (Max Rds On, Min Rds On) 12V
Rds On (Max) @ Id, Vgs 515mOhm @ 5A, 12V
Vgs(th) (Max) @ Id 6V @ 10mA
Gate Charge (Qg) (Max) @ Vgs 27.5 nC @ 15 V
Vgs (Max) ±25V
Input Capacitance (Ciss) (Max) @ Vds 740 pF @ 100 V
Power Dissipation (Max) 100W (Tc)
Operating Temperature -55°C ~ 175°C (TJ)
Mounting Type Through Hole
Supplier Device Package TO-247-3
Package / Case TO-247-3
Base Product Number UF3C170400

Übersicht

Description

The UF3C170400K3S is a specific model of a semiconductor device, typically a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor). It is designed for power management applications, offering features such as low on-resistance, high switching speed, and thermal efficiency. This type of MOSFET is commonly used in power supplies, motor drives, and other electronic circuits where efficient power conversion is critical.
Key specifications often include voltage ratings, current handling capabilities, and package type, which determine its suitability for various applications. The UF3C170400K3S may also be optimized for specific applications like automotive, industrial, or consumer electronics, adhering to relevant safety and performance standards.
For detailed characteristics, including electrical parameters and thermal performance, consulting the manufacturer's datasheet is essential. This document provides comprehensive information on the device's capabilities, recommended operating conditions, and application notes for optimal usage.

Features

The UF3C170400K3S is a compact and versatile power module, typically used in various electronic applications. Key features include:
1. Voltage Range: It supports a wide input voltage range, making it suitable for diverse power supply systems.
2. Output Power: Capable of delivering substantial output power, ensuring efficient performance for demanding applications.
3. Thermal Management: Equipped with advanced thermal management solutions, allowing for stable operation even under high load conditions.
4. Compact Design: Its small form factor is ideal for space-constrained designs in consumer electronics, industrial equipment, and automotive applications.
5. Efficiency: High energy conversion efficiency helps reduce heat generation and prolongs the lifespan of connected components.
6. Protection Features: Includes built-in protection mechanisms such as over-voltage, over-current, and thermal protection to enhance reliability.
7. Flexibility: Compatible with various input and output configurations, providing flexibility in design.
This module is well-suited for applications that require reliable and efficient power conversion in a compact footprint.

Package

The UF3C170400K3S is a component package type typically referred to as a "QFN" (Quad Flat No-lead) or similar surface mount package. It features a compact design suitable for high-density applications, providing good thermal and electrical performance.

Pinout

The UF3C170400K3S is a 4Gb (gigabit) DDR3 SDRAM memory chip. It typically features a pin count of 78 pins in a TSOP-II (Thin Small Outline Package) configuration.
The functions of the pins include:
- Data Input/Output (DQ): This includes multiple DQ pins for data transfer.
- Address Pins (A): Used to select the memory address for read/write operations.
- Control Pins (CK, CK#, CS, RAS, CAS, WE): These pins manage the timing and control of memory operations.
- Power and Ground Pins (VDD, VSS): Provide power supply and ground connections.
This chip is commonly used in various applications, including consumer electronics and computing devices, where it facilitates high-speed data processing and storage.

Manufacturer

The UF3C170400K3S is a product manufactured by ON Semiconductor. ON Semiconductor is a global company that specializes in semiconductor solutions, focusing on various applications such as automotive, industrial, and consumer electronics. The company provides a wide range of products, including power management, sensors, and discrete devices, catering to the growing demand for energy-efficient technologies. ON Semiconductor is known for its commitment to innovation and sustainability within the semiconductor industry.

Application

The UF3C170400K3S is a silicon carbide (SiC) MOSFET designed for high-efficiency power conversion applications. Its primary application areas include electric vehicles, renewable energy systems (like solar inverters and wind turbines), industrial motor drives, and power supplies. It is particularly valued for its high thermal conductivity, low switching losses, and ability to operate at high voltages and temperatures, making it suitable for demanding power electronics applications.

Equivalent

The UF3C170400K3S chip is typically equivalent to other similar memory chips, including the UF3C170400K3M and UF3C170400K3R. However, for precise equivalency, it's best to check the specific datasheet and specifications for compatibility in terms of voltage, speed, and pin configuration. Always consult with the manufacturer or a trusted supplier for the most accurate replacements.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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