X3C07F1-03S

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X3C07F1-03S

RF DIR COUPLER 600MHZ-900MHZ SMD

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Spezifikationen

Series Xinger® III
Part Status Active
Base Product Number X3C07F1
Coupler Type Standard
Frequency 600MHz ~ 900MHz
Applications General Purpose
Insertion Loss 0.17dB
Power - Max 25W
Isolation 26dB
Package 4-SMD, No Lead
Packaging Cut Tape (CT), Tape & Reel (TR)

Übersicht

Description

"Introduction to X3C07F1-03S" seems like a reference to a specific code, model, or identifier, possibly related to a product, technology, or internal project. Without specific context, it is difficult to provide a precise introduction. However, in general, such identifiers are often used in industries like electronics, manufacturing, or software to categorize and manage components, systems, or projects efficiently.
If "X3C07F1-03S" pertains to a technological or industrial product, an introduction would typically include its primary purpose, key features, and applications. For example, if it’s a new electronic component, the introduction would cover its specifications, compatibility with existing systems, and advantages over previous models. In a project context, it might outline objectives, timelines, and team responsibilities.
To provide a more detailed introduction, additional context about what X3C07F1-03S represents is necessary. If you have more details or specific questions, please provide them for a more tailored response.

Features

The X3C07F1-03S is a product model typically associated with electronic or technological devices, such as sensors, connectors, or similar components. While specific features can vary based on the manufacturer or application, common characteristics might include:
1. Connectivity: This model could offer robust connection capabilities suitable for various industrial or technical applications.
2. Durability: Often designed to withstand harsh environments, including resistance to temperature, moisture, and dust.
3. Compact Design: Space-efficient to fit into tight spaces or integrate seamlessly with other components.
4. Compatibility: May support a range of devices or systems, enhancing flexibility in deployment.
5. Reliability: Ensures consistent performance and long operational life, minimizing downtime and maintenance.
For detailed specifications, it is advisable to consult the manufacturer's datasheet or product documentation specific to the X3C07F1-03S model.

Package

The package type for the X3C07F1-03S is often a surface-mount technology (SMT) package, typically used for electronic components like semiconductor devices. However, specific details about the package such as dimensions or exact type (e.g., QFN, BGA) can vary, so it's best to consult the manufacturer's datasheet for precise information.

Pinout

The X3C07F1-03S is an RF component, typically used in radio frequency applications such as impedance matching or signal filtering. It has a 3-pin configuration, which is standard for many RF surface mount devices like baluns or filters. The pin count and specific function may vary slightly depending on the manufacturer or the particular application it's used for, but generally, such components are designed to handle specific frequency bands and provide necessary impedance transformation or filtering.
For detailed specifications like exact pin configuration and precise functionality, consulting the manufacturer's datasheet is recommended, as it will provide exact electrical characteristics, pin assignments, and application guidelines.

Manufacturer

The X3C07F1-03S is manufactured by Anaren, Inc. Anaren is a company specializing in the design and production of high-frequency wireless components and subsystems. They focus on creating advanced RF and microwave technologies for various industries, including aerospace, defense, telecommunications, and consumer electronics.

Application

The X3C07F1-03S is typically a part number for a specific electronic component, such as a connector or sensor. Its application areas can include telecommunications, industrial automation, automotive systems, consumer electronics, and data communications, where reliable and efficient connections or sensor functionalities are crucial. For precise applications, it's essential to consult the manufacturer's datasheet or product documentation.

Equivalent

The X3C07F1-03S chip is a specialized component, and its equivalent products depend on its specific functions such as power rating, frequency, and form factor. To find an exact equivalent, you should research with the manufacturer’s specifications or consult with suppliers. Common equivalents might come from manufacturers like Murata, AVX, or TDK, but you need details like capacitance, voltage, and size to find a precise match. Always cross-reference these specifications when searching for alternatives.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

Payment Methods

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