XA7Z030-1FBV484Q

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XA7Z030-1FBV484Q

IC SOC CORTEX-A9 667MHZ 484FCBGA

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Spezifikationen

Series Zynq®-7000 XA
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature -40°C ~ 125°C (TJ)
Package / Case 484-BBGA, FCBGA
Supplier Device Package 484-FCBGA (23x23)
Base Product Number XA7Z030
Grade Automotive
Qualification AEC-Q100

Übersicht

Description

XA7Z030-1FBV484Q is a Xilinx Zynq-7000 All Programmable SoC (the Zynq Z030 class) in a 484-ball FBGA package. It combines a dual‑core ARM Cortex‑A9 processing system with FPGA fabric on a 28 nm process, enabling tight integration of software and custom hardware. The “XA” prefix often denotes an automotive/industrial-grade variant, and the “1FBV484” describes the 484‑ball FBGA package. The device provides PS (processing system) and PL (programmable logic) integration, along with on‑chip memories and various I/O peripherals (USB, Ethernet, CAN/serial, memory interfaces, etc.) and hardware accelerators via the FPGA fabric. It is intended for embedded applications requiring both control/processing and hardware customization, such as embedded vision, industrial automation, and communications.
Development uses Xilinx toolchains (Vivado/Vitis) to configure PS/PL, plus C/C++/HDL workflows. For exact I/O, memory, speed grade, temperature range, and package details, consult the official datasheet and package specification for XA7Z030-1FBV484Q.

Features

XA7Z030-1FBV484Q is a Xilinx Zynq-7000 All Programmable SoC in a 484-pin FBV package. Key features:
- PS + PL architecture: dual-core ARM Cortex-A9 processor (PS) with FPGA fabric (PL)
- 28 nm process technology
- Rich PS-PL interconnect via high‑bandwidth AXI bridges
- FPGA fabric with LUTs/FFs and Block RAM/UltraRAM for custom logic and storage
- PCIe Gen2 endpoint interface
- I/O and peripherals: Gigabit Ethernet, USB 2.0, CAN, UART, SPI, I2C, GPIO (varies by variant)
- Memory interfaces: supports DDR3/DDR3L/DDR2/LPDDR-type memories (via PS/PL)
- Clocking: integrated MMCMs/PLLs for flexible clocking
- Security: cryptographic engine for AES/DES/RSA and related features
- Debugging/support: JTAG and standard Xilinx development tools
Note: exact counts (logic cells, BRAM, transceivers) vary by device variant; consult the datasheet for precise specifications.

Package

FBGA484 — Flip-Chip Ball Grid Array package with 484 balls.

Pinout

- Pin count: 484 pins (FBGA484)
- Function: Zynq-7000 All Programmable System-on-Chip (XA7Z030) with dual-core ARM Cortex-A9 processing system integrated with FPGA fabric (PS + PL).

Manufacturer

- Manufacturer: Xilinx (now part of AMD)
- What kind of company: A technology company and fabless semiconductor designer specializing in programmable logic devices (FPGAs) and SoCs, along with related software and development tools; manufacturing is outsourced to silicon foundries.

Application

The XA7Z030-1FBV484Q is a Zynq-7000 SoC (ARM Cortex-A9 + FPGA fabric). Common application areas:
- Embedded vision and video processing
- Industrial automation and real-time control
- Robotics, motor control and motion systems
- Communications and networking (SDR, high-speed interfaces)
- Automotive (ADAS, infotainment)
- Medical imaging and data acquisition
- Prototyping/edge computing with FPGA acceleration
(Uses: flexible processing + programmable hardware for custom accelerators.)

Equivalent

Equivalents depend on package, I/O and resources; XA7Z030-1FBV484Q is a Zynq-7000 AP SoC in a 484-ball FBGA. For an exact cross‑reference, provide target packaging (FBV484) and required I/O/resources, or specify cross‑vendor equivalents. If only close proximity is needed, the nearest Xilinx substitutes are other Zynq-7000 parts with similar capacity (e.g., XC7Z030 family).

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