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XC2S200-5FG456I
IC FPGA 284 I/O 456FBGA
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Spezifikationen
| Series | Spartan®-II |
| Part Status | Obsolete |
| Base Product Number | XC2S200 |
| DigiKey Programmable | Not Verified |
| Number of LABs/CLBs | 1176 |
| Number of Logic Elements/Cells | 5292 |
| Total RAM Bits | 57344 |
| Number of I/O | 284 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | 456-BBGA |
| Supplier Device Package | 456-FBGA (23x23) |
| Packaging | Tray |
| Number of Gates | 200000 |
Übersicht
Description
This FPGA supports various I/O standards and provides a range of programmable logic blocks, configurable interconnects, and embedded memory options, making it ideal for applications like digital signal processing, communications, and embedded control systems. Its architecture includes dedicated multiplier blocks and support for advanced design tools, enabling efficient design and implementation.
The XC2S200-5FG456I is widely used in academic research, prototyping, and low-volume production due to its balance of performance, flexibility, and cost-effectiveness.
Features
1. Logic Cells: Offers up to 200,000 system gates and 2,048 logic cells, enabling complex logic designs.
2. Configurable I/O: Supports up to 384 I/O pins with various signaling standards including LVTTL and LVCMOS.
3. Memory: Includes up to 4 Kbits of distributed SRAM for local storage.
4. DSP Blocks: Integrated with DSP slices for efficient digital signal processing.
5. Speed Grade: The '-5' indicates a maximum operating frequency of up to 125 MHz.
6. Package: Encased in a 456-pin Fine Pitch Ball Grid Array (FBGA) for compact design.
7. Power Efficiency: Optimized for low power consumption, making it suitable for portable applications.
8. Development Support: Compatible with Xilinx development tools, facilitating design implementation and testing.
This FPGA is ideal for applications in communications, automotive, and industrial control systems.
Package
Pinout
In terms of functionality, the FPGA is designed for high-performance applications and includes a range of programmable logic blocks, I/O pins, and configurable interconnects. It supports a variety of I/O standards, allowing for flexibility in interfacing with other devices. The device is optimized for low power and high efficiency in processing tasks such as digital signal processing, communications, and complex control algorithms.
The "-5" indicates the speed grade, with "-5" being a faster option. The "FG" denotes the package type (Fine Pitch Grape Ball Grid Array), and the "I" indicates that it is an industrial-grade part, suitable for a wider temperature range. Overall, the XC2S200-5FG456I is used in various applications such as embedded systems, consumer electronics, and telecommunications.
Manufacturer
Application
Equivalent
Versand
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bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
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2. Kredit- / Debitkarte
3. Überweisung
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