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XC2S50-5FG256C
IC FPGA 176 I/O 256FBGA
- Hersteller
- Fr. Teil #XC2S50-5FG256C
- Paket BGA256
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Spezifikationen
| Package | Tray |
| Series | Spartan®-II |
| ProductStatus | Active |
| NumberofLABs/CLBs | 384 |
| NumberofLogicElements/Cells | 1728 |
| TotalRAMBits | 32768 |
| NumberofI/O | 176 |
| NumberofGates | 50000 |
| Voltage-Supply | 2.375V ~ 2.625V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 256-BGA |
Übersicht
Description
The device is packaged in a Fine-Pitch Ball Grid Array (FBGA) format with 256 balls, allowing for high-density connections. The Spartan-2 architecture includes dedicated memory blocks, digital signal processing (DSP) slices, and a range of I/O standards, providing versatility in design.
With a maximum operating frequency of 200 MHz and support for various development tools, the XC2S50-5FG256C allows designers to implement complex algorithms and functionalities efficiently. It is particularly valued for its balance of performance, flexibility, and cost, making it a popular choice for embedded systems and prototyping in various electronic applications.
Features
1. Logic Cells: 50,000 system gates, with a rich set of configurable logic blocks.
2. I/O Pins: 256 I/O pins, supporting various voltage standards.
3. Performance: Operates at a maximum clock frequency of up to 200 MHz, depending on design complexity.
4. Configurable Resources: Includes dedicated RAM blocks and multiplier blocks for efficient data processing.
5. Power Consumption: Low power operation, making it suitable for battery-powered devices.
6. Development Tools: Compatible with Xilinx ISE software for design implementation and verification.
7. Package: Available in a Fine-Pitch Ball Grid Array (FBGA) package, facilitating compact designs.
8. Temperature Range: Supports industrial-grade temperature ranges, enhancing reliability in various environments.
The XC2S50-5FG256C is ideal for applications in communications, automotive, industrial control, and consumer electronics.
Package
Pinout
The primary functions of the XC2S50-5FG256C include:
1. Programmable Logic: It provides configurable logic blocks (CLBs) for implementing custom digital logic.
2. I/O Functionality: Supports multiple I/O standards and configurations, enabling connections to various peripheral devices.
3. Memory Interfaces: Capable of interfacing with RAM and other memory types.
4. Dedicated Features: Includes digital signal processing (DSP) blocks, RAM blocks, and configuration interfaces for programming.
This FPGA is designed for a range of applications, including telecommunications, automotive, and consumer electronics.
Manufacturer
Application
Equivalent
1. XC3S50-5FG256C - Spartan-3 series
2. Lattice iCE40 LP1K - Lattice Semiconductor
3. Altera/Intel EP2S15 - Stratix II series
These alternatives can provide similar logic capacity and performance, but ensure to verify specific requirements for compatibility.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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